Pupil division multiplexed imaging systems

    公开(公告)号:US11353359B1

    公开(公告)日:2022-06-07

    申请号:US17228614

    申请日:2021-04-12

    Abstract: The present disclosure provides an imaging optical system. In one aspect, the imaging optical system includes, among other things, a segmented light redirecting element configured to redirect the at least two portions of said electromagnetic radiation into substantially different directions and a segmented light separating element configured to substantially separate electromagnetic radiation into at least two portions.

    Low footprint optical interconnects

    公开(公告)号:US10775572B1

    公开(公告)日:2020-09-15

    申请号:US15972823

    申请日:2018-05-07

    Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

    Pupil division multiplexed imaging systems

    公开(公告)号:US11892349B1

    公开(公告)日:2024-02-06

    申请号:US17489079

    申请日:2021-09-29

    CPC classification number: G01J1/0407 G01J1/42

    Abstract: The present disclosure provides an imaging optical system. In one aspect, the imaging optical system includes, among other things, a segmented light redirecting element configured to redirect the at least two portions of said electromagnetic radiation into substantially different directions and a segmented light separating element configured to substantially separate electromagnetic radiation into at least two portions.

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