公开(公告)号：US08896491B1

公开(公告)日：2014-11-25

申请号：US14206213

申请日：2014-03-12

Applicant: Wistron NeWeb Corp.

Inventor： Bing-Chun Chung ,  Chia-Shang Cheng

IPC: H01Q21/26 ,  H01Q1/42

CPC classification number: H01Q21/26 ,  H01Q15/14

Abstract: A cross-type transmission module is provided, including a first circuit board, a second circuit board, a first positioning structure, a second positioning structure and a base. The first circuit board includes a first antenna. The second circuit board includes a second antenna. The second circuit board intersects the first circuit board. The first V-shaped groove and a second V-shaped groove are formed between the first circuit board and the second circuit board. The first V-shaped groove is opposite to the second V-shaped groove. The first positioning structure is disposed in the first V-shaped groove, and is connected to the first circuit board and the second circuit board. The second positioning structure is disposed in the second V-shaped groove, and is connected to the first circuit board and the second circuit board. The first positioning structure and the second positioning structure are secured to the base.

Abstract translation: 提供一种交叉型传输模块，包括第一电路板，第二电路板，第一定位结构，第二定位结构和基座。 第一电路板包括第一天线。 第二电路板包括第二天线。 第二电路板与第一电路板相交。 第一V形槽和第二V形槽形成在第一电路板和第二电路板之间。 第一V形槽与第二V形槽相对。 第一定位结构设置在第一V形槽中，并连接到第一电路板和第二电路板。 第二定位结构设置在第二V形槽中，并连接到第一电路板和第二电路板。 第一定位结构和第二定位结构固定在基座上。

公开(公告)号：US09786991B2

公开(公告)日：2017-10-10

申请号：US14227623

申请日：2014-03-27

Applicant: Wistron NeWeb Corp.

Inventor： Bing-Chun Chung ,  Chia-Shang Cheng

IPC: H01Q9/28 ,  H01Q15/14 ,  H01Q21/24 ,  H01Q21/28

CPC classification number: H01Q9/285 ,  H01Q15/14 ,  H01Q21/24 ,  H01Q21/28 ,  Y10T29/49016

Abstract: A method for assembling a cross-type transmission module is provided, which includes the following steps. First, a first circuit board and a second circuit board are provided, wherein the first circuit board includes a first antenna, and the second circuit board includes a first groove and a second antenna. Then, the first circuit board is inserted partially through the first groove along an insertion direction to connect the first circuit board to the second circuit board, wherein the first circuit board is on a first plane, the second circuit board is on a second plane, an included angle θ is formed between the insertion direction and the second plane, and the included angle is not zero. In this embodiment, the included angle is 90 degrees, and the second plane is perpendicular to the first plane.