公开(公告)号：US20240014129A1

公开(公告)日：2024-01-11

申请号：US18372977

申请日：2023-09-26

Applicant: X Display Company Technology Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Christopher Michael Verreen ,  Erik Paul Vick

IPC: H01L23/525 ,  H01L23/544 ,  H01L23/528

CPC classification number: H01L23/5258 ,  H01L23/544 ,  H01L23/528 ,  H01L27/124

Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.

公开(公告)号：US11088121B2

公开(公告)日：2021-08-10

申请号：US16806613

申请日：2020-03-02

Applicant: X Display Company Technology Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/538

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20220165666A1

公开(公告)日：2022-05-26

申请号：US17670810

申请日：2022-02-14

Applicant: X Display Company Technology Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Christopher Michael Verreen ,  Erik Paul Vick

IPC: H01L23/525 ,  H01L23/544 ,  H01L23/528

Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.

公开(公告)号：US20200259057A1

公开(公告)日：2020-08-13

申请号：US16806613

申请日：2020-03-02

Applicant: X Display Company Technology Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L33/62 ,  H01L23/538

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US11804431B2

公开(公告)日：2023-10-31

申请号：US17670810

申请日：2022-02-14

Applicant: X Display Company Technology Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Christopher Michael Verreen ,  Erik Paul Vick

IPC: H01L23/525 ,  H01L23/544 ,  H01L23/528 ,  H01L27/12

CPC classification number: H01L23/5258 ,  H01L23/528 ,  H01L23/544 ,  H01L27/124

Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.

公开(公告)号：US11282786B2

公开(公告)日：2022-03-22

申请号：US16702352

申请日：2019-12-03

Applicant: X Display Company Technology Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Christopher Michael Verreen ,  Erik Paul Vick

IPC: H01L23/525 ,  H01L23/528 ,  H01L23/544 ,  H01L27/12

Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.