公开(公告)号：US10103069B2

公开(公告)日：2018-10-16

申请号：US15461703

申请日：2017-03-17

Applicant: X-Celeprint Limited

Inventor： Christopher Andrew Bower ,  Ronald S. Cok ,  Matthew Meitl ,  Carl Ray Prevatte, Jr.

IPC: H01L33/00 ,  H01L21/66 ,  H01L33/56 ,  H01L33/62 ,  H01L25/00 ,  H01L27/12 ,  H01L27/32 ,  H01L23/00

Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

公开(公告)号：US10163735B2

公开(公告)日：2018-12-25

申请号：US15830645

申请日：2017-12-04

Applicant: X-Celeprint Limited

Inventor： Christopher Andrew Bower ,  Ronald S. Cok ,  Matthew Meitl ,  Carl Ray Prevatte, Jr.

IPC: H01L21/66 ,  H01L33/56 ,  H01L33/62 ,  H01L23/00 ,  H01L25/00 ,  H01L27/12 ,  H01L51/00 ,  H01L27/32 ,  H01L51/10 ,  H01L51/52

Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

公开(公告)号：US20180323178A1

公开(公告)日：2018-11-08

申请号：US16039191

申请日：2018-07-18

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Brook Raymond ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Erich Radauscher ,  Carl Ray Prevatte, Jr. ,  António José Marques Trindade ,  Tanya Yvette Moore

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/041 ,  H01L25/072 ,  H01L25/50 ,  H01L33/0095 ,  H01L33/62

Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

公开(公告)号：US20190051552A1

公开(公告)日：2019-02-14

申请号：US16058097

申请日：2018-08-08

Applicant: X-Celeprint Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L21/683 ,  B41F16/00 ,  H01L33/00 ,  H01L21/67

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US10153257B2

公开(公告)日：2018-12-11

申请号：US15456273

申请日：2017-03-10

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Meitl ,  Carl Ray Prevatte, Jr. ,  Salvatore Bonafede ,  Robert R. Rotzoll

IPC: H01L25/075 ,  H01L27/32 ,  H01L33/62 ,  H01L25/00

Abstract: A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.

公开(公告)号：US10510937B2

公开(公告)日：2019-12-17

申请号：US16186173

申请日：2018-11-09

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, Jr.

IPC: H01L23/538 ,  H01L41/083 ,  H01L23/12 ,  H01L33/62 ,  H01L33/48 ,  H01L41/047 ,  H01L25/065

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.