Method and Device for Printing on Heated Substrates
    1.
    发明申请
    Method and Device for Printing on Heated Substrates 审中-公开
    加热基板上印刷的方法和装置

    公开(公告)号:US20160229209A1

    公开(公告)日:2016-08-11

    申请号:US15131195

    申请日:2016-04-18

    Applicant: XJET LTD.

    CPC classification number: B41J29/377 B05C11/10 B41J2/14 B41J2202/08

    Abstract: A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.

    Abstract translation: 提供了一种用于在加热的基板上放置材料的印刷装置。 该装置可以包括具有一个或多个喷嘴的打印头和在打印时部分地掩盖打印头面向加热的基板的一侧的热屏蔽,以便减少从基板到打印头的热传递。 护罩包括与一个或多个喷嘴对准的狭槽,以使材料能够从一个或多个喷嘴传递到被加热的基底。

    METHOD AND DEVICE FOR PRINTING ON HEATED SUBSTRATES

    公开(公告)号:US20190232696A1

    公开(公告)日:2019-08-01

    申请号:US16262320

    申请日:2019-01-30

    Applicant: XJET LTD.

    Abstract: A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.

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