公开(公告)号：US20210285091A1

公开(公告)日：2021-09-16

申请号：US17202226

申请日：2021-03-15

Applicant: XTPL S.A.

Inventor： Anna Stanczak ,  Jolanta Gadzalinska ,  Mateusz Lysien ,  Aneta Wiatrowska ,  Filip Granek

IPC: C23C14/35 ,  C23C14/08 ,  C04B35/457

Abstract: A method of decreasing a sheet resistance of a transparent conductor is disclosed. The method includes the following: forming a first transparent conductor layer on a substrate; dispensing a metallic nanoparticle composition on the first transparent conductor layer to form metallic nanoparticle features; and sintering at least the first transparent conductor layer and the metallic nanoparticle features. The first transparent conductor layer includes a crystalline metal oxide. The aperture ratio of the transparent conductor is in a range of 90% to 99%.
A multilayer transparent conductor and a method of forming a multilayer transparent conductor are also disclosed.