公开(公告)号：US20140342161A1

公开(公告)日：2014-11-20

申请号：US14352893

申请日：2011-10-18

Applicant: Xianping Zeng

Inventor： Xianping Zeng

IPC: C08G59/42 ,  H05K1/05 ,  C08L63/04

CPC classification number: C08G59/4223 ,  C08G59/24 ,  C08G59/3218 ,  C08G59/4215 ,  C08G59/4276 ,  C08L63/04 ,  H05K1/0326 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  Y10T428/31522 ,  C08L67/00

Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

Abstract translation: 提供环氧树脂组合物和使用它们的预浸料和覆铜层压板。 环氧树脂组合物包含以下主要成分：（A）含有萘酚结构的环氧树脂; （B）活性酯固化剂; （C）固化促进剂。 本发明的环氧组合物可用于制备具有低吸水性和低介电损耗值的环氧树脂缩合物。 制造的预浸料和覆铜层压板具有良好的介电性能，耐湿性和耐热性能以及高玻璃化转变温度。

公开(公告)号：US20140349120A1

公开(公告)日：2014-11-27

申请号：US14352389

申请日：2011-10-18

Applicant: Xianping Zeng

Inventor： Xianping Zeng

IPC: H05K1/03 ,  C08L63/04

CPC classification number: H05K1/0353 ,  C08G59/3218 ,  C08G59/4014 ,  C08G59/4215 ,  C08G59/4223 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  C08L63/04 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/31522 ,  C08L67/02 ,  C08L67/00 ,  C08L79/04

Abstract: Disclosed are an epoxy resin composition and a high frequency circuit board manufactured by using the same, and the epoxy resin composition comprises the following solid components: (A) a cyanate compound having at least two cyanoxy groups or its prepolymer, (B) an active ester, and (C) an epoxy resin containing a naphthol structure. The total amount of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer and the component (B) an active ester is 10-70 parts by weight, and the amount of component (C) an epoxy resin containing a naphthol structure is 30-90 parts by weight, based on the parts by weight of these solid components, wherein the weight ratio of the component (A) a cyanate compound having at least two cyanoxy groups or its prepolymer to the component (B) an active ester is 0.2-5 to 1. The high frequency circuit board manufactured by using the epoxy resin composition comprises multiple layers of laminated semi-cured sheets and copper foils press-bonded on both sides of them, and each of the multiple layers of laminated semi-cured sheets comprises a substrate and the epoxy resin composition attached on it by impregnating and drying.

Abstract translation: 公开了一种环氧树脂组合物和使用该环氧树脂组合物制造的高频电路板，环氧树脂组合物包含以下固体组分：（A）具有至少两个氰氧基的氰酸酯化合物或其预聚物，（B）活性 酯，和（C）含有萘酚结构的环氧树脂。 组分（A）具有至少两个氰氧基的氰酸酯化合物或其预聚物和组分（B）的活性酯的总量为10-70重量份，并且组分（C）含有环氧树脂的量 基于这些固体组分的重量份，萘酚结构为30-90重量份，其中组分（A）具有至少两个氰氧基的氰酸酯化合物或其预聚物与组分（B）的重量比为 活性酯为0.2-5:1。通过使用环氧树脂组合物制造的高频电路板包括多层叠层半固化片和两面压接在其上的铜箔，并且多层 层压半固化片材包括基材和通过浸渍和干燥附着在其上的环氧树脂组合物。

公开(公告)号：US20150240055A1

公开(公告)日：2015-08-27

申请号：US14427084

申请日：2012-09-14

Applicant: Xianping Zeng ,  Nana Ren

Inventor： Xianping Zeng ,  Nana Ren

IPC: C08K5/5313 ,  B32B5/26 ,  B32B15/20 ,  H01B3/40 ,  B32B15/14

CPC classification number: C08K5/5313 ,  B32B5/26 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/20 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/704 ,  B32B2307/7265 ,  B32B2363/00 ,  B32B2457/08 ,  C08G59/28 ,  C08G59/3227 ,  C08G59/42 ,  C08G59/4246 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/53 ,  C08K5/5317 ,  H01B3/40 ,  Y10T442/2213 ,  Y10T442/3423 ,  Y10T442/656 ,  C08L63/00

Abstract: The present invention relates to an epoxy resin composition and a prepreg and a copper-clad laminate made by using same. The epoxy resin composition comprises components as follows: an epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain, a phosphate salt compound and an active ester hardener; the amount of the epoxy resin containing 3 or more epoxy groups and containing nitrogen in the molecular chain is 100 parts by weight, the amount of the phosphate salt compound is 5˜50 parts by weight. The equivalent ratio of the amount of the active ester hardener, based on the ratio between epoxy equivalent and active ester equivalent, is 0.85˜1.2. The prepreg and the copper-clad laminate made by using the epoxy resin composition have excellent dielectric performance, moisture-heat resistant performance, simultaneously have a high glass transition temperature and a lower water absorption rate and simultaneously realize halogen-free flame retardancy, and achieve UL-94V-0.

Abstract translation: 本发明涉及环氧树脂组合物和通过使用它们制备的预浸料和覆铜层压板。 环氧树脂组合物包含以下成分：含有3个以上环氧基并在分子链中含有氮的环氧树脂，磷酸盐化合物和活性酯硬化剂; 在分子链中含有3个以上环氧基并含有氮的环氧树脂的量为100重量份，磷酸盐化合物的量为5〜50重量份。 基于环氧当量与活性酯当量之比的活性酯固化剂的当量比为0.85〜1.2。 通过使用环氧树脂组合物制成的预浸料坯和覆铜层压板具有优异的介电性能，耐湿热性能，同时具有高的玻璃化转变温度和较低的吸水率，同时实现无卤阻燃，并实现 UL-94V-0。

公开(公告)号：US20120164463A1

公开(公告)日：2012-06-28

申请号：US13334806

申请日：2011-12-22

Applicant: Junqi Tang ,  Xianping Zeng

Inventor： Junqi Tang ,  Xianping Zeng

IPC: B32B15/08 ,  B05D5/10 ,  C08L79/00 ,  C08G61/12 ,  C08L63/00

CPC classification number: H05K1/0353 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/20 ,  B32B2250/05 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/714 ,  B32B2457/08 ,  C08G73/0655 ,  C08L79/04 ,  C08L79/085 ,  H05K1/0366 ,  Y10T428/31699 ,  C08L63/00

Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent processability, thermal resistance and humidity resistance, and low water absorption, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent processability, thermal resistance and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.

Abstract translation: 本发明提供一种氰酸酯树脂组合物和由氰酸酯树脂组合物制成的预浸料和层压体。 氰酸酯树脂组合物包含含有由以下结构式（1）表示的结构的氰酸酯树脂：其中R1，R2和R3是氢原子，烷基或芳烷基; n是1〜50的整数。本发明的氰酸酯树脂组合物具有优异的加工性，耐热性和耐湿性，以及低吸水性等。预浸料，层压板和覆盖金属箔的层压板由 氰酸酯树脂组合物具有优异的加工性，耐热性和耐湿性，以及低吸水性等，从而适用于制造高密度PCB的基材，具有非常高的工业应用价值。