公开(公告)号：US20100315795A1

公开(公告)日：2010-12-16

申请号：US12788507

申请日：2010-05-27

Applicant: Yasuo YOKOYAMA

Inventor： Yasuo YOKOYAMA

IPC: H05K7/00 ,  H05K3/30

CPC classification number: H05K3/3442 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/111 ,  H05K3/3484 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of manufacturing an electronic component including a first surface mount device and a second surface mount device is provided. The first surface mount device and the second surface mount device are joined to a substrate via joint materials such that either or both of the first and second surface mount devices are shifted from the locations corresponding to land electrodes located on the substrate so as to be aligned with each other and are subjected to a reflow process. The outer land electrodes are formed at locations shifted inwardly from the locations corresponding to a virtual arrangement state in which the first surface mount device and the second surface mount device are arranged in series such that an end surface of the first surface mount device is in contact with an end surface of the second surface mount device.

Abstract translation: 提供一种制造包括第一表面安装装置和第二表面贴装装置的电子部件的方法。 第一表面安装器件和第二表面安装器件通过接合材料接合到衬底，使得第一和第二表面安装器件中的任一个或两者从对应于位于衬底上的焊盘电极的位置偏移以对准 并进行回流处理。 外部接地电极形成在从与第一表面安装器件和第二表面安装器件串联布置的虚拟布置状态对应的位置向内移位的位置处，使得第一表面安装器件的端面接触 具有第二表面安装装置的端面。