公开(公告)号：US20150053932A1

公开(公告)日：2015-02-26

申请号：US14144598

申请日：2013-12-31

Applicant: Ye Xin Technology Consulting Co., Ltd.

Inventor： PEN-CHU LIN

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

CPC classification number: H01L27/3244 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/5275 ,  H01L51/56 ,  H01L2251/5315

Abstract: An organic light emitting diode (OLED) package includes a substrate, an OLED die mounted on the substrate and an encapsulation layer encapsulating the OLED die. The OLED package further includes a protecting layer formed on the OLED die. The encapsulation layer has a multi-layered structure and is deposited on the protecting layer. Refractive indexes of a cathode of the OLED die, the protecting layer and the encapsulation layer are gradually decreased in the sequence. A barrier layer for blocking moisture from entering the OLED package is formed on a bottom surface of the substrate by atomic layer deposition (ALD) method. The present disclosure also provides a method for manufacturing the OLED package.

Abstract translation: 有机发光二极管（OLED）封装包括衬底，安装在衬底上的OLED裸片和封装OLED裸片的封装层。 OLED封装还包括形成在OLED裸片上的保护层。 封装层具有多层结构并沉积在保护层上。 OLED芯片的阴极，保护层和封装层的折射率按顺序逐渐减小。 通过原子层沉积（ALD）方法在衬底的底表面上形成用于阻止水分进入OLED封装的阻挡层。 本公开还提供了用于制造OLED封装的方法。