Organic light emitting diode package and method for manufacturing the same
    1.
    发明授权
    Organic light emitting diode package and method for manufacturing the same 有权
    有机发光二极管封装及其制造方法

    公开(公告)号:US09165986B2

    公开(公告)日:2015-10-20

    申请号:US14144598

    申请日:2013-12-31

    Inventor: Pen-Chu Lin

    Abstract: An organic light emitting diode (OLED) package includes a substrate, an OLED die mounted on the substrate and an encapsulation layer encapsulating the OLED die. The OLED package further includes a protecting layer formed on the OLED die. The encapsulation layer has a multi-layered structure and is deposited on the protecting layer. Refractive indexes of a cathode of the OLED die, the protecting layer and the encapsulation layer are gradually decreased in the sequence. A barrier layer for blocking moisture from entering the OLED package is formed on a bottom surface of the substrate by atomic layer deposition (ALD) method. The present disclosure also provides a method for manufacturing the OLED package.

    Abstract translation: 有机发光二极管(OLED)封装包括衬底,安装在衬底上的OLED裸片和封装OLED裸片的封装层。 OLED封装还包括形成在OLED裸片上的保护层。 封装层具有多层结构并沉积在保护层上。 OLED芯片的阴极,保护层和封装层的折射率按顺序逐渐减小。 通过原子层沉积(ALD)方法在衬底的底表面上形成用于阻止水分进入OLED封装的阻挡层。 本公开还提供了用于制造OLED封装的方法。

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