公开(公告)号：US20150209377A1

公开(公告)日：2015-07-30

申请号：US14585978

申请日：2014-12-30

Applicant: Shi-Lung Lin ,  Samantha Chang-Lin ,  Yi-Wen Lin ,  Donald Chang

Inventor： Shi-Lung Lin ,  Samantha Chang-Lin ,  Yi-Wen Lin ,  Donald Chang

IPC: A61K31/7012 ,  A61K31/221

CPC classification number: A61K31/221 ,  A61K9/0053 ,  A61K9/08 ,  A61K31/7012 ,  A61K31/7024 ,  C12N15/111 ,  C12N15/113 ,  C12N2310/141 ,  C12N2320/32 ,  C12N2330/50 ,  C12N2330/51

Abstract: This invention is related to a novel sugar-like chemical composition and its use for diabetes therapy. Particularly, the present invention teaches the use of monosaccharide-like glycylated sugar alcohol compounds to block or reduce sugar absorption in diabetes patients, so as to prevent the risk of hyperglycemia symptoms. Glycylation of sugar alcohols is a totally novel reaction that has never been reported before. Therefore, the novelty of the present invention is that for the first time glycylated sugar alcohols not only was found but also was found to be useful for treating Diabetes mellitus. In addition, the present invention teaches a method for producing these glycylated sugar alcohols. In sum, the present invention includes not only a kind of novel sugar-like chemical compositions and its use for treating diabetes but also a state-of-the-art protocol and methodology for producing such a novel composition via glycylation of sugars and sugar alcohols.

Abstract translation: 本发明涉及新型糖类化学组合物及其用于糖尿病治疗的用途。 特别地，本发明教导了使用单糖样的糖化糖醇化合物来阻止或减少糖尿病患者的糖吸收，以防止高血糖症状的风险。 糖醇的糖基化是一种完全新颖的反应，从未在之前报道过。 因此，本发明的新颖性不仅首次发现了糖化糖醇，而且被发现可用于治疗糖尿病。 此外，本发明教导了一种制备这些糖基化糖醇的方法。 总之，本发明不仅包括一种新型的糖类化学组合物及其用于治疗糖尿病的用途，而且还包括通过糖和糖醇的糖基化制备这种新型组合物的最新方案和方法 。

公开(公告)号：US08805916B2

公开(公告)日：2014-08-12

申请号：US12380841

申请日：2009-03-03

Applicant: Martin Langhammer ,  Yi-Wen Lin ,  Keone Streicher

Inventor： Martin Langhammer ,  Yi-Wen Lin ,  Keone Streicher

IPC: G06F7/38 ,  G06F7/00 ,  G06F15/00 ,  H03K19/173 ,  H03K19/177 ,  H01L25/00 ,  H03K5/1252 ,  G06F7/53

CPC classification number: H03K5/1252 ,  G06F7/5324 ,  G06F2207/382 ,  H03K19/17732

Abstract: Digital signal processing (“DSP”) circuit blocks are provided that can more easily work together to perform larger (e.g., more complex and/or more arithmetically precise) DSP operations if desired. These DSP blocks may also include redundancy circuitry that facilitates stitching together multiple such blocks despite an inability to use some block (e.g., because of a circuit defect).

Abstract translation: 提供数字信号处理（“DSP”）电路块，如果需要，可以更容易地一起工作来执行更大（例如更复杂和/或更具有算术精度）的DSP操作。 尽管不能使用某些块（例如，由于电路缺陷），这些DSP块还可以包括有助于将多个这样的块拼接在一起的冗余电路。

公开(公告)号：US08549055B2

公开(公告)日：2013-10-01

申请号：US12716878

申请日：2010-03-03

Applicant: Keone Streicher ,  Martin Langhammer ,  Yi-Wen Lin ,  Wai-Bor Leung ,  David Lewis ,  Volker Mauer ,  Henry Y. Lui ,  Suleyman Sirri Demirsoy ,  Hyun Yi

Inventor： Keone Streicher ,  Martin Langhammer ,  Yi-Wen Lin ,  Wai-Bor Leung ,  David Lewis ,  Volker Mauer ,  Henry Y. Lui ,  Suleyman Sirri Demirsoy ,  Hyun Yi

IPC: G06F7/38 ,  G06F7/00

CPC classification number: G06F17/10 ,  G06F7/5324 ,  G06F2207/382 ,  H03H17/06 ,  H03H2220/06 ,  H03K19/17732

Abstract: Digital signal processing (“DSP”) circuit blocks are provided that can more easily work together to perform larger (e.g., more complex and/or more arithmetically precise) DSP operations if desired. These DSP blocks may also include redundancy circuitry that facilitates stitching together multiple such blocks despite an inability to use some block (e.g., because of a circuit defect). Systolic registers may be included at various points in the DSP blocks to facilitate use of the blocks to implement systolic form, finite-impulse-response (“FIR”), digital filters.

Abstract translation: 提供数字信号处理（“DSP”）电路块，如果需要，可以更容易地一起工作来执行更大（例如更复杂和/或更具有算术精度）的DSP操作。 尽管不能使用某些块（例如，由于电路缺陷），这些DSP块还可以包括有助于将多个这样的块拼接在一起的冗余电路。 收缩寄存器可以包括在DSP块中的各个点处，以便于使用块来实现收缩形式，有限脉冲响应（“FIR”），数字滤波器。

公开(公告)号：US20110069509A1

公开(公告)日：2011-03-24

申请号：US12869774

申请日：2010-08-27

Applicant: Hung-Chih Lin ,  Yi-Wen Lin

Inventor： Hung-Chih Lin ,  Yi-Wen Lin

IPC: F21V7/22

CPC classification number: G02B6/0088 ,  G02B6/0068 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/133322 ,  G02F2201/46 ,  G02F2201/503

Abstract: A backlight module includes a back plate, a plurality of position limiting elements, a light guiding plate, and a light source. The position limiting elements are disposed on the back plate, and each of the position limiting elements includes a pillar and a cushion sheath covering the pillar. The light guiding plate is disposed on the back plate, and has a plurality of first position limiting portions. The first position limiting portions respectively contact the position limiting elements to position the light guiding plate on the back plate. The light source is disposed at a side of the light guiding plate.

Abstract translation: 背光模块包括背板，多个位置限制元件，导光板和光源。 位置限制元件设置在背板上，并且每个位置限制元件包括覆盖柱的柱和衬垫护套。 导光板配置在背板上，具有多个第一位置限制部。 第一位置限制部分分别接触位置限制元件以将导光板定位在背板上。 光源设置在导光板的一侧。

公开(公告)号：US07838005B2

公开(公告)日：2010-11-23

申请号：US12561321

申请日：2009-09-17

Applicant: Chih-Cheng Chen ,  Shyh-Jer Huang ,  Yi-Wen Lin

Inventor： Chih-Cheng Chen ,  Shyh-Jer Huang ,  Yi-Wen Lin

IPC: A61K39/00

CPC classification number: G01N33/5035 ,  A61K31/7052 ,  A61K48/00 ,  G01N33/5044 ,  G01N33/6872 ,  G01N2800/042

Abstract: Disclosed are a method of for treating insulin resistance and a method identifying a compound for treating insulin resistance.

Abstract translation: 公开了一种治疗胰岛素抵抗的方法，以及鉴定用于治疗胰岛素抵抗的化合物的方法。

公开(公告)号：US20100228807A1

公开(公告)日：2010-09-09

申请号：US12380841

申请日：2009-03-03

Applicant: Martin Langhammer ,  Yi-Wen Lin ,  Keone Streicher

Inventor： Martin Langhammer ,  Yi-Wen Lin ,  Keone Streicher

IPC: G06F7/00

CPC classification number: H03K5/1252 ,  G06F7/5324 ,  G06F2207/382 ,  H03K19/17732

Abstract: Digital signal processing (“DSP”) circuit blocks are provided that can more easily work together to perform larger (e.g., more complex and/or more arithmetically precise) DSP operations if desired. These DSP blocks may also include redundancy circuitry that facilitates stitching together multiple such blocks despite an inability to use some block (e.g., because of a circuit defect).

Abstract translation: 提供数字信号处理（“DSP”）电路块，如果需要，可以更容易地一起工作来执行更大（例如更复杂和/或更具有算术精度）的DSP操作。 尽管不能使用某些块（例如，由于电路缺陷），这些DSP块还可以包括有助于将多个这样的块拼接在一起的冗余电路。

公开(公告)号：US20090109060A1

公开(公告)日：2009-04-30

申请号：US11979052

申请日：2007-10-30

Applicant: Yu-Nan Liu ,  Yi-Wen Lin ,  Hui-Ying Chiang ,  Tai-Lung Chang ,  Chun-Fang Hsieh ,  Jing-Nuan Lai ,  Shou-Chang Yeh

Inventor： Yu-Nan Liu ,  Yi-Wen Lin ,  Hui-Ying Chiang ,  Tai-Lung Chang ,  Chun-Fang Hsieh ,  Jing-Nuan Lai ,  Shou-Chang Yeh

IPC: G08G1/095

CPC classification number: G08G1/095 ,  E01F9/20 ,  G02B6/0043 ,  G02B6/006

Abstract: The present invention discloses an optical-film traffic sign, which comprises: a light-guide element, an optical film and at least one light source. A plurality of diffusion dots is printed on the light-guide element. The light from the light source is repeatedly scattered by the diffusion dots. Thereby, the light-guide element becomes a highly uniform planar light source. The optical film having a traffic sign is applied onto the surface of the light-guide element to form a slim and uniformly-luminous traffic sign. The present invention may adopt LED as the light source and thus has the advantage of energy saving.

Abstract translation: 本发明公开了一种光学交通标志，其包括：导光元件，光学膜和至少一个光源。 多个扩散点印刷在导光元件上。 来自光源的光被漫射点反复散射。 由此，导光元件成为高度均匀的平面光源。 具有交通标志的光学膜被施加到导光元件的表面上以形成纤细和均匀发光的交通标志。 本发明可以采用LED作为光源，因此具有节能的优点。

公开(公告)号：US08611071B2

公开(公告)日：2013-12-17

申请号：US13243513

申请日：2011-09-23

Applicant: Chun-Lung Su ,  Yi-Wen Lin

Inventor： Chun-Lung Su ,  Yi-Wen Lin

IPC: H02B1/26 ,  H02B1/20

CPC classification number: H05K7/1492 ,  G06F1/189

Abstract: A power supply structure of a multi-power-supply system which is electrically connected to at least one power supply to get an output power provided by the power supply. The multi-power-supply system includes a power integration back panel and a casing. The power integration back panel is electrically connected to a DC output port and has at least one output cord to receive the power provided by the power supply. The casing has a housing compartment to hold the power integration back panel, an opening for loading the power supply into the housing compartment, and at least one partition to divide the housing compartment to form a space to hold the power supply, a wiring space threaded through by the output cord, and a power supply port exposed outside the surface of the casing to electrically connect to the output cord.

Abstract translation: 多电源系统的电源结构，其电连接到至少一个电源以获得由电源提供的输出功率。 多电源系统包括电源集成后面板和外壳。 电力集成后面板电连接到直流输出端口，并且具有至少一个输出线以接收由电源提供的电力。 壳体具有用于保持功率整合后面板的壳体隔间，用于将电源装载到壳体隔室中的开口，以及至少一个隔板以分隔壳体隔间以形成用于保持电源的空间，线路空间螺纹 通过输出线，以及暴露在壳体表面外的电源，以电连接到输出线。

公开(公告)号：US08573811B2

公开(公告)日：2013-11-05

申请号：US13073057

申请日：2011-03-28

Applicant: Hung-Chih Lin ,  Yi-Wen Lin

Inventor： Hung-Chih Lin ,  Yi-Wen Lin

IPC: F21V29/00

CPC classification number: G02B6/0085

Abstract: A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element.

Abstract translation: 背光模块包括导光板，背板，散热元件，发光元件和至少一个高性能散热器。 所述散热元件与所述导光板的光入射面相邻配置，所述散热元件具有与所述底部形成角度的底部和侧面部。 发光元件设置在散热元件面向导光板的一侧。 高性能散热器设置在背板上，高性能散热器的一端与散热元件重叠，高性能散热器的另一端远离发光元件。

公开(公告)号：US20110249470A1

公开(公告)日：2011-10-13

申请号：US13073057

申请日：2011-03-28

Applicant: Hung-Chih LIN ,  Yi-Wen Lin

Inventor： Hung-Chih LIN ,  Yi-Wen Lin

IPC: F21V7/22

CPC classification number: G02B6/0085

Abstract: A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element.

Abstract translation: 背光模块包括导光板，背板，散热元件，发光元件和至少一个高性能散热器。 所述散热元件与所述导光板的光入射面相邻配置，所述散热元件具有与所述底部形成角度的底部和侧面部。 发光元件设置在散热元件面向导光板的一侧。 高性能散热器设置在背板上，高性能散热器的一端与散热元件重叠，高性能散热器的另一端远离发光元件。