公开(公告)号：US20120256307A1

公开(公告)日：2012-10-11

申请号：US13440337

申请日：2012-04-05

Applicant: Yugo KOYAMA

Inventor： Yugo KOYAMA

IPC: H01L23/538 ,  H01L21/50 ,  H01L23/02

CPC classification number: G01C19/5783 ,  B81B7/0074 ,  B81B2201/025 ,  G01C19/5621 ,  H01L23/055 ,  H01L23/3192 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the first flat surface and the second flat surface, and a fourth flat surface opposed to the first flat surface as an attachment surface to an external member, the first flat surface having a support surface depressed from the first flat surface, IC chips having connection terminals on active surface sides with inactive surface sides along the active surfaces respectively attached to the respective surfaces of the support member, and vibration gyro elements having connection electrodes, and the vibration gyro elements are provided on the active surface sides of the IC chips and the connection electrodes are attached to the connection terminals of the IC chips so that principal surfaces are respectively along the respective surfaces of the support member.

Abstract translation: 传感器模块包括具有第一平坦表面的支撑构件，与第一平坦表面正交连接的第二平坦表面，与第一平坦表面和第二平坦表面正交连接的第三平坦表面和与第一平坦表面相对的第四平坦表面 所述第一平面具有从所述第一平面凹下的支撑面，所述第一平面具有从所述第一平面凹下的支撑面，所述IC芯片具有在所述有源面侧的连接端子，所述IC芯片沿着所述有源面分别具有不平坦的表面侧， 和具有连接电极的振动陀螺元件，并且振动陀螺元件设置在IC芯片的有源面侧，并且连接电极附接到IC芯片的连接端子，使得主表面分别沿着 支撑构件的各个表面。

公开(公告)号：US20120236507A1

公开(公告)日：2012-09-20

申请号：US13413908

申请日：2012-03-07

Applicant: Yugo KOYAMA

Inventor： Yugo KOYAMA

IPC: H05K7/06 ,  H05K3/30

CPC classification number: G01C19/5783 ,  H01L23/3192 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A sensor module includes a supporting member having three support faces orthogonal to one another, three IC chips each having connection terminals and external connection terminals on the side thereof where an active face is located, the three IC chips attached to the support faces of the supporting member on the sides thereof where passive faces lying along the active faces are located, three vibrating gyro elements each having a base, vibrating arms extending from the base, and connection electrodes, and flexible wiring substrates connected to the external connection terminals of the IC chips, each vibrating gyro element is disposed on the side of the IC chip where the active face is located, the connection electrodes are attached to the connection terminals of each IC chip such that one principal surface lies along the support face, and the flexible wiring substrate has a reinforcing layer.

Abstract translation: 传感器模块包括具有彼此正交的三个支撑面的支撑构件，具有连接端子的三个IC芯片和其主动面位于其一侧的外部连接端子，三个IC芯片附接到支撑面的支撑面 位于主动面位于被动面的侧面上的构件，具有底座的三个振动陀螺元件，从基座延伸的振动臂和连接电极以及连接到IC芯片的外部连接端子的柔性布线基板 每个振动陀螺元件设置在有源面所在的IC芯片的一侧，连接电极被安装在每个IC芯片的连接端子上，使得一个主表面沿着支撑面设置，并且柔性布线基板 具有加强层。