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1.发明申请公开(公告)号：US20070111392A1
公开(公告)日：2007-05-17
申请号：US11650449
申请日：2007-01-08
Applicant: Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
Inventor： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi , Masaaki Sato , Michirou Kawanishi
IPC: H01L21/00
CPC classification number: H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , H01L2221/68327 , H01L2924/19041 , Y10T428/28
Abstract: A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent. In this manner, the chip cut piece can be thermally released from the overheat and release type pressure sensitive adhesive sheet while position displacement in a horizontal direction can be prevented.
Abstract translation: 从热脱模型压敏粘合片过热释放切屑的方法是将切屑粘贴到具有基材的热释放型压敏粘合片和含有热膨胀性微球的热释放型微球的方法 设置在基材表面上的可热膨胀的压敏粘合剂层从热释放型压敏粘合片热释放，其特征在于包括过热的步骤，同时限制过热和释放型压敏粘合片从而释放 切片切片。 用于抑制热释放型压敏粘合片的装置可以是使用吸附的吸收装置，或者可以是使用粘合剂的粘合装置。 以这种方式，切屑切片可以从过热和释放型压敏粘合片热释放，同时可以防止在水平方向上的位置偏移。
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公开(公告)号：US06998175B2
公开(公告)日：2006-02-14
申请号：US09853787
申请日：2001-05-14
Applicant: Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
Inventor： Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
CPC classification number: C09J7/22 , C09J7/38 , C09J2205/11 , Y10S428/922 , Y10T428/14 , Y10T428/28 , Y10T428/2813 , Y10T428/2848 , Y10T428/2852 , Y10T428/2857 , Y10T428/2878 , Y10T428/2891
Abstract: A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 Ω/□ or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 μm or less and a maximum surface roughness of 5 μm or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.
Abstract translation: 即使用于临时固定耐静电性差的电子部件（例如磁头）的热剥离性粘合片也能有效地防止这种电子部件的收率因静电破坏而减少，同时确保 其加热前的粘合性和加热后的剥离性的功能。 热剥离性粘合片包括基材，在其至少一面形成有含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的表面电阻率 10 12Ω/□以下。 在该热剥离性粘合片中，加热前的热膨胀性压敏粘合剂层的中心线平均表面粗糙度可以为2μm以下，最大表面粗糙度为5μm以下。 粘合片可以具有插入在基板和热膨胀性压敏粘合剂层之间的橡胶状有机弹性层。
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3.发明授权公开(公告)号：US06488803B2
公开(公告)日：2002-12-03
申请号：US09782037
申请日：2001-02-14
Applicant: Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
Inventor： Kazuyuki Kiuchi , Toshiyuki Oshima , Akihisa Murata , Yukio Arimitsu
IPC: B32B712
CPC classification number: H01L21/6836 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2433/00 , H01L2221/68327 , H01L2924/19041 , Y10T428/28 , Y10T428/2809 , Y10T428/2839 , Y10T428/2848 , Y10T428/2852 , Y10T428/2887
Abstract: A radiation-curable heat-peelable pressure-sensitive adhesive sheet is disclosed which has tackiness enabling adherends to withstand transportation and other steps, with which cutting can be conducted without flinging up an adhesive waste or causing chipping, and from which the cut pieces can be easily separated and recovered. The radiation-curable heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a pressure-sensitive adhesive layer containing heat-expandable microspheres and a radiation-curable compound. A work to be cut is placed on the surface of the pressure-sensitive adhesive layer of the radiation-curable heat-peelable pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive layer is irradiated with a radiation to cure the adhesive layer. The work is cut into pieces and the pressure-sensitive adhesive layer is then thermally foamed, before the cut pieces are separated and recovered from the adhesive sheet. Thus, cut pieces can be efficiently produced without arousing troubles in processing steps.
Abstract translation: 公开了一种可辐射固化的可热剥离的压敏粘合片，其具有使被粘物能够承受运输等步骤的粘性，通过该步骤可以进行切割，而不会使粘合剂废料卷起或引起碎裂，并且切割片可以从其 容易分离和回收。 可辐射固化的可热剥离的压敏粘合片包括基底，并且在其至少一个侧面上形成含有热膨胀性微球体和可辐射固化化合物的压敏粘合剂层。 将待切割的工件放置在可辐射固化的可热剥离的压敏粘合片的压敏粘合剂层的表面上，并用辐射照射粘合剂层以固化粘合剂层。 在将切割片从粘合片分离并回收之前，将工件切成块，然后将压敏粘合剂层热发泡。 因此，可以有效地生产切片，而不会在加工步骤中引起麻烦。
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4.发明授权Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus 失效具有清洁功能的清洁片，转印部件以及清洗基板处理装置的方法公开(公告)号：US08524007B2
公开(公告)日：2013-09-03
申请号：US12977762
申请日：2010-12-23
Applicant: Daisuke Uenda , Yukio Arimitsu , Yoshio Terada , Yasuhiro Amano , Akihisa Murata
Inventor： Daisuke Uenda , Yukio Arimitsu , Yoshio Terada , Yasuhiro Amano , Akihisa Murata
CPC classification number: B08B1/00 , B08B7/0028 , H01L21/02096 , Y10T428/24355 , Y10T428/2457 , Y10T428/24612 , Y10T428/31
Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.
Abstract translation: 一种清洁片，包括具有0.05微米以下的算术平均粗糙度Ra和1.0mum以下的最大高度Rz的微细度形状的清洁层。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。 清洁片可以设置在转印构件的至少一个表面上，使得转印构件具有清洁功能。 当清洁片或具有清洁功能的转印元件在衬底处理设备中转移以代替待处理衬底时，清洁片接触并清洁衬底处理设备的位置。
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5.发明申请ADHESIVE SHEET, PROCESS FOR PRODUCING THE SAME, AND METHOD OF CUTTING MULTILAYERED CERAMIC SHEET 审中-公开粘合片及其制造方法以及切割多层陶瓷片的方法公开(公告)号：US20110200744A1
公开(公告)日：2011-08-18
申请号：US13093940
申请日：2011-04-26
Applicant: Takamasa HIRAYAMA , Kazuyuki Kiuchi , Masaaki Sato , Yukio Arimitsu , Daisuke Shimokawa , Tomoko Kishimoto
Inventor： Takamasa HIRAYAMA , Kazuyuki Kiuchi , Masaaki Sato , Yukio Arimitsu , Daisuke Shimokawa , Tomoko Kishimoto
CPC classification number: H01L21/6836 , C08K7/22 , C09J7/29 , C09J7/385 , C09J2201/162 , C09J2203/326 , C09J2205/106 , C09J2205/11 , C09J2433/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2924/19041 , H01L2924/30105 , Y10T83/0405 , Y10T428/25
Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 μm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 μm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.
Abstract translation: 本发明涉及一种粘合片，其包括基材和包含热膨胀性微球的粘合层，所述粘合层设置在所述基材的至少一侧，所述粘合层的厚度为10〜38μm， 并且其中所述热膨胀性微球具有等于或小于所述粘着层的厚度的最大粒径，并且具有5至30μm的模式直径。 本发明的粘合片能够在小型陶瓷电容器等电子部件的加工工序中进行高精度加工，从而大大提高产品特性和生产率。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20080019078A1
公开(公告)日：2008-01-24
申请号：US10592132
申请日：2005-02-18
Applicant: Yukio Arimitsu , Akihisa Murata , Tomoko Kishimoto
Inventor： Yukio Arimitsu , Akihisa Murata , Tomoko Kishimoto
CPC classification number: H01L21/6835 , C09J5/08 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2205/302 , H01L2221/68331 , H01L2924/19041 , H01L2924/30105 , Y10T428/14 , Y10T428/1405 , Y10T428/1476 , Y10T428/28 , Y10T428/2809 , Y10T428/2813
Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.
Abstract translation: 公开了一种可以防止由于加压过程中的加压引起的压敏粘合剂层变形并且可以容易地从处理物品剥离的热剥离性粘合片。 热剥离性粘合片包括基材和布置在基材的至少一面上或上方的热可膨胀压敏粘合剂层，并且含有发泡剂，其中热膨胀性压敏粘合剂 在7×10 -6 Pa以上的未发泡状态下具有剪切模量（23℃）。 热可膨胀压敏粘合剂层优选具有小于7×10 -6 Pa的未发泡状态的剪切模量（95℃）。 热膨胀性压敏粘合剂层中的发泡剂优选具有高于80℃的泡沫起始温度。
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7.发明授权公开(公告)号：US08524361B2
公开(公告)日：2013-09-03
申请号：US12716306
申请日：2010-03-03
Applicant: Kazuki Soejima , Takamasa Hirayama , Daisuke Shimokawa , Masaaki Sato , Yukio Arimitsu
Inventor： Kazuki Soejima , Takamasa Hirayama , Daisuke Shimokawa , Masaaki Sato , Yukio Arimitsu
CPC classification number: H01G4/12 , C09J7/22 , C09J7/38 , C09J2205/302 , C09J2433/00 , C09J2467/006 , H01G4/308 , Y10T156/1052 , Y10T428/14 , Y10T428/266 , Y10T428/28 , Y10T428/2813 , Y10T428/2852 , Y10T428/31504
Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of −40° C. to 30° C.
Abstract translation: 本发明涉及一种用于切割叠层陶瓷片的热剥离性压敏粘合片，其用于在层压陶瓷片的切割时的临时固定，所述可热剥离的压敏粘合片包括基材，并形成 在基材的至少一个表面上，含有压敏粘合剂和发泡剂的热膨胀性压敏粘合剂层，其中热膨胀性压敏粘合剂层的凝胶分数为50重量％ 以上，热膨胀性粘合剂层的玻璃化转变温度为-40℃〜30℃。
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8.发明授权公开(公告)号：US07811647B2
公开(公告)日：2010-10-12
申请号：US10592132
申请日：2005-02-18
Applicant: Yukio Arimitsu , Akihisa Murata , Tomoko Kishimoto
Inventor： Yukio Arimitsu , Akihisa Murata , Tomoko Kishimoto
CPC classification number: H01L21/6835 , C09J5/08 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2205/302 , H01L2221/68331 , H01L2924/19041 , H01L2924/30105 , Y10T428/14 , Y10T428/1405 , Y10T428/1476 , Y10T428/28 , Y10T428/2809 , Y10T428/2813
Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.
Abstract translation: 公开了一种可以防止由于加压过程中的加压引起的压敏粘合剂层变形并且可以容易地从处理物品剥离的热剥离性粘合片。 热剥离性粘合片包括基材和布置在基材的至少一面上或上方的热可膨胀压敏粘合剂层，并且含有发泡剂，其中热膨胀性压敏粘合剂 层的剪切模量（23℃）为7×10 6 Pa以上的未发泡状态。 热膨胀性压敏粘合剂层的未发泡状态的剪切弹性模量（95℃）优选为小于7×10 6 Pa。发泡剂优选具有泡沫起始 温度高于80℃
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公开(公告)号：US20100119757A1
公开(公告)日：2010-05-13
申请号：US12450917
申请日：2008-04-15
Applicant: Daisuke Shimokawa , Yukio Arimitsu
Inventor： Daisuke Shimokawa , Yukio Arimitsu
CPC classification number: H01G4/308 , C08K3/346 , C09J7/38 , C09J11/04 , C09J2201/134 , C09J2205/102 , C09J2205/11 , H01G4/30 , Y10T156/1052 , Y10T428/1405
Abstract: Provided is a heat-peelable double-sided pressure-sensitive adhesive sheet that is advantageously usable in the step of cutting a multilayer ceramic sheet performed in a high-temperature atmosphere. Also provided is a process for the cutting of a multilayer ceramic sheet using the above-mentioned sheet.The heat-peelable double-sided pressure-sensitive adhesive sheet includes a substrate; arranged on one side thereof, a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres; and arranged on the other side, a temporary-fixing pressure-sensitive adhesive layer containing a lipophilic layered clay mineral. The lipophilic layered clay mineral is preferably a layered silicate. The lipophilic layered clay mineral may be present in an amount of 0.1 to 45 parts by weight per 100 parts by weight of a base polymer of a pressure-sensitive adhesive constituting the temporary-fixing pressure-sensitive adhesive layer.
Abstract translation: 提供一种可热切剥离的双面粘合片，其有利地用于在高温气氛中进行的多层陶瓷片的切割工序。 还提供了使用上述片材切割多层陶瓷片的方法。 可热剥离的双面粘合片包括基材; 设置在其一侧，包含热膨胀性微球的热膨胀性压敏粘合剂层; 并且在另一侧上布置有包含亲油层状粘土矿物的临时固定压敏粘合剂层。 亲油性层状粘土矿物优选为层状硅酸盐。 亲水性层状粘土矿物质可以以每100重量份构成临时定影压敏粘合剂层的压敏粘合剂的基础聚合物计为0.1至45重量份的量存在。
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10.发明授权公开(公告)号：US07641760B2
公开(公告)日：2010-01-05
申请号：US11296323
申请日：2005-12-08
Applicant: Tomoko Doi , Daisuke Shimokawa , Yukio Arimitsu
Inventor： Tomoko Doi , Daisuke Shimokawa , Yukio Arimitsu
IPC: B32B38/10
CPC classification number: H01L21/6836 , B29C63/0013 , C09J7/38 , C09J2203/326 , C09J2205/11 , C09J2205/302 , H01L2221/68327 , H01L2924/19041 , Y10S438/976 , Y10T156/1147 , Y10T156/1153 , Y10T156/1911
Abstract: A method of thermal adherend release, wherein a part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet by partly heating the heat-peelable pressure-sensitive adhesive sheet, wherein the method comprises previously heating a sticking site of an adherend to be released at a temperature at which the heat-expandable layer of the heat-peelable pressure-sensitive adhesive sheet does not expand and then heating the sticking site of the adherend in the heat-peelable pressure-sensitive adhesive sheet at a temperature at which the heat-expandable layer expands to thereby selectively releasing the adherend.
Abstract translation: 一种热粘贴体的剥离方法，其特征在于，将具有含有发泡剂的具有热膨胀层的热剥离性粘合片附着的被粘附物的一部分从所述压敏粘合片选择性地释放， 压敏粘合片，其中，所述方法包括在所述可热剥离性粘合片的热膨胀层未膨胀的温度下预先加热待剥离的被粘物的粘贴部位，然后加热所述粘贴部位 在热膨胀层膨胀的温度下，在热剥离粘合片中的被粘物，从而选择性地释放被粘物。
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