公开(公告)号：US10074827B2

公开(公告)日：2018-09-11

申请号：US15308800

申请日：2016-02-04

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Hyun Suk Kim ,  Jung Ok Moon ,  Se Woo Yang

IPC: H01L23/28 ,  C09J7/38 ,  C09J123/22 ,  H01L51/52 ,  H01L51/00 ,  H01L51/44 ,  H01L51/10 ,  H01L23/31

CPC classification number: H01L51/5253 ,  B32B7/12 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/36 ,  B32B37/12 ,  B32B37/1207 ,  B32B2307/302 ,  B32B2307/724 ,  B32B2457/206 ,  C08F255/10 ,  C08K3/16 ,  C08K3/22 ,  C08K5/01 ,  C08K5/101 ,  C08K2003/3045 ,  C09J4/06 ,  C09J7/10 ,  C09J7/38 ,  C09J7/381 ,  C09J123/22 ,  C09J133/04 ,  C09J133/08 ,  C09J151/04 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/10 ,  C09J2400/10 ,  C09J2423/00 ,  H01L23/28 ,  H01L23/3135 ,  H01L51/004 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5237 ,  H01L51/5259 ,  H01L51/56 ,  C08F2220/1883

Abstract: Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the pressure-sensitive adhesive composition, which can form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

公开(公告)号：US20170313031A1

公开(公告)日：2017-11-02

申请号：US15651849

申请日：2017-07-17

Applicant: Mitsubishi Chemical Corporation

Inventor： Makoto INENAGA

IPC: B32B17/10 ,  C09J7/02 ,  C09J5/00 ,  B32B7/12

CPC classification number: B32B17/10018 ,  B32B7/12 ,  B32B17/10174 ,  B32B17/1055 ,  B32B2369/00 ,  C09J5/00 ,  C09J7/29 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2205/31 ,  C09J2400/143 ,  Y10T428/24959 ,  Y10T428/2809

Abstract: In order to enable lamination of materials of different kinds, such as a synthetic resin plate and a glass plate, without leaving bubbles between the materials, a double sided adhesive sheet (1) is formed by forming an adhesive layer (3) cross-linked with ultraviolet light on one surface of a sheet (2) with an inorganic oxide layer (2B) and forming an adhesive layer (4) cross-linked by heating or moisture on the other surface of the sheet (2). A glass plate (6) is applied to the adhesive layer (3), and a synthetic resin plate (7) is applied to the adhesive layer (4), thereby forming a laminate panel (5).

公开(公告)号：US20170226384A1

公开(公告)日：2017-08-10

申请号：US15501486

申请日：2016-02-23

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi KAWAMOTO ,  Izumi SHIMIZU ,  Ikkou HANAKI ,  Kiichiro MATSUSHITA

IPC: C09J7/02

CPC classification number: C09J7/22 ,  C09J7/38 ,  C09J133/066 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2423/046 ,  C09J2433/00

Abstract: A double-sided pressure-sensitive adhesive tape includes a support base member having a hand tearable property, a first acrylic adhesive layer on one surface of the support base member, and a second acrylic adhesive layer on another surface of the support base member. The first acrylic adhesive layer has a thickness t1 that is 5 μm or more and 50 μm or less, the second acrylic adhesive layer has a thickness t2 that is greater than the thickness t1 of the first acrylic adhesive layer and is 20 μm or more, the second acrylic adhesive layer has gel fraction X2 that is 20 mass % or more and 75 mass % or less, and the second acrylic adhesive layer has adhesive force greater than adhesive force of the first acrylic adhesive layer.

公开(公告)号：US20160250834A1

公开(公告)日：2016-09-01

申请号：US15149713

申请日：2016-05-09

Applicant: Takahiro NORIMATSU

Inventor： Takahiro NORIMATSU

IPC: B32B37/00 ,  B32B27/36 ,  B32B7/12 ,  B32B37/26 ,  B32B7/06

CPC classification number: B32B37/0007 ,  B32B7/06 ,  B32B7/12 ,  B32B27/36 ,  B32B37/12 ,  B32B37/1284 ,  B32B37/144 ,  B32B37/203 ,  B32B37/26 ,  B32B2037/268 ,  B32B2250/04 ,  B32B2255/10 ,  B32B2309/10 ,  B32B2309/16 ,  B32B2367/00 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/134 ,  C09J2433/00 ,  C09J2467/006 ,  Y10T156/10 ,  Y10T428/1452

Abstract: A double-sided adhesive tape rolled on a cylindrical roll core includes a polyethylene terephthalate film having a first surface and a second surface opposite to the first surface, a first adhesive layer applied on the first surface of the polyethylene terephthalate film, a release sheet laminated on the first surface of the polyethylene terephthalate film through the first adhesive layer, the release sheet being laminated so as to turn exterior to the polyethylene terephthalate film, and a second adhesive layer applied on the second surface of the polyethylene terephthalate film. In the double-sided adhesive tape, 100 N/m or larger of tensile force is applied to the polyethylene terephthalate film when the release sheet is laminated onto the first adhesive layer applied on the first surface of the polyethylene terephthalate film.

公开(公告)号：US20160208144A1

公开(公告)日：2016-07-21

申请号：US14915587

申请日：2014-08-21

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Shinichi USUGI ,  Kouji IGARASHI ,  Akimitsu MORIMOTO

IPC: C09J7/02 ,  H01L21/683 ,  H01L21/56

CPC classification number: C09J7/0285 ,  B32B3/085 ,  B32B7/12 ,  B32B25/12 ,  B32B25/18 ,  B32B27/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/306 ,  B32B2307/736 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/00 ,  B32B2457/14 ,  C09J7/20 ,  C09J7/255 ,  C09J7/385 ,  C09J201/00 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2477/006 ,  C09J2479/086 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/26 ,  H01L24/96 ,  H01L2221/68381 ,  H01L2224/12105 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.

Abstract translation: 本发明的粘合膜包括基材层和层叠在其中的自剥离粘合剂层。 基材层在流动方向（MD方向的热收缩率）和相对于流动方向（TD方向的热收缩率）的正交方向的热收缩率（在TD方向的热收缩率）满足时的热收缩率 满足以下条件：（1）在150℃加热30分钟后，在MD方向热收缩百分率/ TD方向的热收缩百分比＆gt;＆gt; 2.5和MD方向的热收缩率的平均值 在TD方向的收缩百分率＆nlE; 2％，（2）在200℃下加热10分钟后，0.4＆nlE; MD方向的热收缩率/ TD方向的热收缩率|＆nlE; 2.5和热收缩的平均值 MD方向的百分比和TD方向的热收缩百分比≧3％。

公开(公告)号：US20150353793A1

公开(公告)日：2015-12-10

申请号：US14720223

申请日：2015-05-22

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hiroyuki YASUDA ,  Michihiro SUGO

IPC: C09J183/14 ,  H01L21/304 ,  C09J153/00 ,  H01L21/683

CPC classification number: C09J183/14 ,  C08G77/442 ,  C09J5/04 ,  C09J5/06 ,  C09J7/00 ,  C09J7/10 ,  C09J125/08 ,  C09J153/005 ,  C09J153/025 ,  C09J183/10 ,  C09J2201/134 ,  C09J2203/326 ,  C09J2425/00 ,  C09J2453/003 ,  C09J2483/00 ,  H01L21/187 ,  H01L21/304 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y02P20/582 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2878

Abstract: The invention is adhesive material for a wafer processing used for temporarily bonding a supporting substrate to wafer having a front surface includes circuit formed thereon and a back surface to be processed, including first temporary adhesive layer composed of a layer of a silicone-modified styrene base thermoplastic elastomer, and second temporary adhesive layer composed of a thermosetting polymer layer on first temporary adhesive layer, wherein layer is capable of releasably adhering to front surface of wafer, and layer is capable of releasably adhering to the supporting substrate. Thereby, it provides a temporary adhesive material for wafer processing, wafer processing lamination, and method for manufacturing thin wafer using same, which facilitates temporary adhesion between supporting substrate and wafer having a circuit, is highly compatible with steps of forming TSV and forming wiring on back surface of wafer, allows easy delamination, and is capable of increasing productivity of thin wafers.

Abstract translation: 本发明是用于将支撑基板暂时地接合到具有前表面的晶片处理的粘合材料，其中包括形成在其上的电路和待加工的后表面，包括由硅树脂改性的苯乙烯基层 热塑性弹性体和由第一临时粘合剂层上的热固性聚合物层组成的第二临时粘合剂层，其中层能够可释放地粘附在晶片的正面，并且层能够可释放地粘附到支撑基底。 由此，提供了用于晶片处理的临时粘合材料，晶片加工层叠以及使用它们的薄晶片的制造方法，其有助于支撑基板和具有电路的晶片之间的临时粘合，与形成TSV并形成布线的步骤高度兼容 晶片的背面容易分层，能够提高薄晶片的生产率。

公开(公告)号：US09175190B2

公开(公告)日：2015-11-03

申请号：US13819513

申请日：2011-08-26

Applicant: Volker Paschmann ,  Siegfried K. Welke ,  Klaus Malecki ,  Detlef Richert

Inventor： Volker Paschmann ,  Siegfried K. Welke ,  Klaus Malecki ,  Detlef Richert

IPC: C09J5/00 ,  B23P19/04 ,  C09J7/02

CPC classification number: C09J5/00 ,  B23P19/047 ,  C09J7/26 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2453/00

Abstract: There is provided a method of attaching an elongate strip to a door frame of the body of a vehicle comprising application of the elongate strip by means of a device comprising: i. a drive means; ii. an application head; iii. a stress control unit positioned between the drive means and application head and comprising one of more sensor units; iv. and a control unit for controlling the drive means, the elongate strip comprises an adhesive tape comprising a foam layer having first and second major sides and a pressure sensitive adhesive layer associated with one of the major sides of the foam layer, the pressure sensitive adhesive comprising a cross-linked rubber and the foam layer comprises an acrylic polymer of one or more alkyl acrylates having an average of 3 to 14 carbon atoms in the alkyl group, the foam layer having a density of at least 540 kg/m3.

Abstract translation: 提供了一种将细长带附接到车辆车体的门框上的方法，包括借助于以下装置应用细长条带：i。 驱动装置; ii。 应用头; iii。 位于驱动装置和应用头之间的应力控制单元，包括多个传感器单元之一; iv。 以及用于控制驱动装置的控制单元，细长条带包括一个胶带，该胶带包括具有第一和第二主要侧面的泡沫层和与泡沫层的主要侧面相关联的压敏粘合剂层，压敏粘合剂包括 交联橡胶和泡沫层包含烷基中平均具有3至14个碳原子的一种或多种丙烯酸烷基酯的丙烯酸聚合物，泡沫层的密度至少为540kg / m 3。

公开(公告)号：US20150287940A1

公开(公告)日：2015-10-08

申请号：US14740006

申请日：2015-06-15

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Yoon Gyung CHO ,  Suk Ky CHANG ,  Jung Sup SHIM ,  Suk Chin LEE ,  Kwang Jin JEONG

IPC: H01L51/00 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract translation: 提供了一种粘合剂，以及使用其的封装产品和封装有机电子器件（OED）的方法。 粘合膜用于包封OED并且包括可固化树脂和吸湿剂，并且粘合剂包括在封装OED时与OED接触的第一区域和不与OED接触的第二区域。 此外，基于粘合剂中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。

公开(公告)号：US09109141B2

公开(公告)日：2015-08-18

申请号：US13122910

申请日：2009-10-08

Applicant: Makoto Inenaga

Inventor： Makoto Inenaga

IPC: C09J7/02 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  C09J7/00 ,  G06F3/041 ,  G06F3/045 ,  G02F1/1333

CPC classification number: C09J7/02 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  B32B2307/412 ,  B32B2457/20 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/318 ,  C09J2433/00 ,  G02F1/13338 ,  G02F2201/50 ,  G02F2202/28 ,  G06F3/041 ,  G06F3/045 ,  Y10T428/1462 ,  Y10T428/24942 ,  Y10T428/24967 ,  Y10T428/28 ,  Y10T428/2839

Abstract: Provided is a novel transparent adhesive sheet with which the cut edge is not sticky over time when a laminated body that has been bonded via the adhesive sheet is cut, which can be adhered without generating residual air bubbles, even when the surface of an adherend is uneven, and which can be adhered without foaming, even when the adherend is a material such as plastic that can generate outgas. Suggested is an adhesive sheet that has one or more layers of a first adhesive layer and one or more layer of a second adhesive layer that exhibit different viscoelastic behaviors, and has an integrated structure whereby these layers are laminated, with a dynamic shear storage modulus G′ of 2×104 to 5×105 Pa for G′(20° C.) and 1×104 to 1×105 Pa for G′(150° C.) when measured with a 1 Hz frequency temperature dispersion.

Abstract translation: 提供了一种新颖的透明粘合片，当经过粘合片粘合的层叠体被切割时，切割边缘不会随着时间的推移粘附，即使当被粘物的表面为 不均匀，即使当被粘物是能够产生气体的塑料材料时，也可以粘附而不发泡。 提出了一种粘合片，其具有一层或多层第一粘合剂层和一层或多层第二粘合剂层，其具有不同的粘弹性行为，并且具有层压这些层的一体结构，具有动态剪切储能模量G 对于G'（20℃）为2×104〜5×105Pa，对于G'（150℃）为1×104〜1×105Pa。

公开(公告)号：US09105648B2

公开(公告)日：2015-08-11

申请号：US14289212

申请日：2014-05-28

Applicant: LG Chem, Ltd.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong ,  Suk Ky Chang

IPC: H01L29/08 ,  H01L35/24 ,  H01L51/00 ,  H01L23/00 ,  H01L51/52 ,  H05B33/04 ,  H01L51/56 ,  C09J7/00 ,  C09J7/02 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C09J163/00 ,  C08K3/16

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract translation: 提供了一种粘合剂，以及使用其的封装产品和封装有机电子器件（OED）的方法。 粘合膜用于包封OED并且包括可固化树脂和吸湿剂，并且粘合剂包括在封装OED时与OED接触的第一区域和不与OED接触的第二区域。 此外，基于粘合剂中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。