公开(公告)号：US10374190B2

公开(公告)日：2019-08-06

申请号：US15108138

申请日：2014-12-25

Applicant: ZEON CORPORATION

Inventor： Satoshi Tazaki ,  Hiroyasu Inoue ,  Atsushi Ishiguro ,  Yohei Koide

IPC: B32B3/08 ,  B32B27/28 ,  B32B7/10 ,  B32B7/04 ,  B32B27/32 ,  B32B27/08 ,  B32B7/12 ,  B32B7/02 ,  H01L51/52 ,  H01L29/786 ,  B32B27/30 ,  G02B5/30 ,  H01L27/12

Abstract: A sealing film including a substrate film, a sealing layer, and an adhesive layer in this order, wherein the sealing film has a tensile elastic modulus of equal to or higher than 1,000 MPa, and retardation of a layer portion provided at the sealing layer side relative to the substrate film in the sealing film after sealing is equal to or smaller than 20 nm.

公开(公告)号：US11322269B2

公开(公告)日：2022-05-03

申请号：US16306655

申请日：2017-06-23

Applicant: ZEON CORPORATION

Inventor： Kenichi Harai ,  Satoshi Tazaki ,  Kazuyuki Obuchi

IPC: H01B5/14 ,  B32B27/00 ,  C09D7/65 ,  B32B25/16 ,  B32B27/30 ,  C08J7/04 ,  C08J7/043 ,  C08J7/044 ,  C08J7/046 ,  B32B27/36 ,  C08F297/04 ,  C08J5/18 ,  C09D5/24 ,  C09D165/00 ,  H01B3/44 ,  C08K3/08

Abstract: An electroconductive film including a resin layer and an electroconductive layer, wherein the resin layer has a storage elastic modulus at 25° C. of more than 10 MPa and less than 1,000 MPa, and the electroconductive layer has a surface resistance value of 1,000 Ω/sq. or less.