公开(公告)号：US20230389897A1

公开(公告)日：2023-12-07

申请号：US18236233

申请日：2023-08-21

Applicant: Exo Imaging, Inc.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: A61B8/00 ,  H01L23/00 ,  B06B1/02 ,  B06B1/06 ,  G01S15/89 ,  B81B7/00

CPC classification number: A61B8/4494 ,  H01L24/73 ,  H01L24/32 ,  H01L24/48 ,  B06B1/0215 ,  B06B1/0622 ,  B06B1/0666 ,  B06B1/067 ,  B06B1/0681 ,  A61B8/4488 ,  G01S15/8938 ,  G01S15/8965 ,  B81B7/0058 ,  B06B2201/76 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/098 ,  H01L2224/73265 ,  H01L2224/73253 ,  H01L2224/73207 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/16145 ,  H01L2924/1461

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US11730451B2

公开(公告)日：2023-08-22

申请号：US17155940

申请日：2021-01-22

Applicant: eXo Imaging, Inc.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: B06B1/06 ,  A61B8/00 ,  H01L23/00 ,  B06B1/02 ,  G01S15/89 ,  B81B7/00

CPC classification number: A61B8/4494 ,  A61B8/4488 ,  B06B1/0215 ,  B06B1/067 ,  B06B1/0622 ,  B06B1/0666 ,  B06B1/0681 ,  B81B7/0058 ,  G01S15/8938 ,  G01S15/8965 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  B06B2201/76 ,  B81B2207/012 ,  B81B2207/053 ,  B81B2207/098 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/1461

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US12295790B2

公开(公告)日：2025-05-13

申请号：US18236233

申请日：2023-08-21

Applicant: Exo Imaging, Inc.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: B06B1/06 ,  A61B8/00 ,  B06B1/02 ,  B81B7/00 ,  G01S15/89 ,  H01L23/00

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US20190290243A1

公开(公告)日：2019-09-26

申请号：US15933309

申请日：2018-03-22

Applicant: EXO IMAGING INC.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: A61B8/00 ,  B81B7/00 ,  H01L23/00 ,  B06B1/02 ,  B06B1/06 ,  G01S15/89

Abstract: A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US10966683B2

公开(公告)日：2021-04-06

申请号：US15933309

申请日：2018-03-22

Applicant: EXO IMAGING INC.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: B06B1/06 ,  A61B8/00 ,  H01L23/00 ,  B06B1/02 ,  G01S15/89 ,  B81B7/00

Abstract: A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

公开(公告)号：US20210137497A1

公开(公告)日：2021-05-13

申请号：US17155940

申请日：2021-01-22

Applicant: eXo Imaging, Inc.

Inventor： Janusz Bryzek ,  Sandeep Akkaraju ,  Yusuf Haque ,  Joe Adam

IPC: A61B8/00 ,  H01L23/00 ,  B06B1/02 ,  B06B1/06 ,  G01S15/89 ,  B81B7/00

Abstract: Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.