公开(公告)号：US11866614B2

公开(公告)日：2024-01-09

申请号：US17471642

申请日：2021-09-10

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbuscher ,  Christian Schuh ,  Bernd Luhmann ,  Thilo Dollase ,  Minyoung Bai ,  Thorsten Krawinkel

IPC: C09J125/08 ,  C09J153/00 ,  C09J153/02 ,  C09J7/38 ,  C08L63/00 ,  B82Y30/00 ,  B82Y40/00 ,  H10K50/844

CPC classification number: C09J125/08 ,  C08L63/00 ,  C09J7/387 ,  C09J153/00 ,  C09J153/025 ,  B82Y30/00 ,  B82Y40/00 ,  C08L2205/04 ,  C09J2301/122 ,  C09J2301/124 ,  C09J2301/302 ,  C09J2301/312 ,  C09J2425/00 ,  C09J2453/00 ,  H10K50/844 ,  Y10T428/269 ,  Y10T428/287 ,  C09J153/025 ,  C08L63/00

Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.