公开(公告)号：US20230092613A1

公开(公告)日：2023-03-23

申请号：US17983188

申请日：2022-11-08

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04 ,  C08K5/14

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

公开(公告)号：US20230323170A9

公开(公告)日：2023-10-12

申请号：US17983188

申请日：2022-11-08

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04 ,  C08K5/14

CPC classification number: C09J175/04 ,  C08K5/14 ,  C09J2301/408 ,  C08L2666/66 ,  C08K5/0025

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

公开(公告)号：US11535778B2

公开(公告)日：2022-12-27

申请号：US17051074

申请日：2019-04-26

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04 ,  C08K5/14 ,  C08K5/00

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

公开(公告)号：US20210214593A1

公开(公告)日：2021-07-15

申请号：US17051074

申请日：2019-04-26

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.