公开(公告)号：US20250089169A1

公开(公告)日：2025-03-13

申请号：US18955511

申请日：2024-11-21

Applicant: xFusion Digital Technologies Co., Ltd.

Inventor： Guoqiang Liu ,  Zhongli Ji

IPC: H05K1/14 ,  H05K1/02

Abstract: Embodiments of this application provide a computing node and a computing device. The computing node includes a mainboard and a current guiding structure. An electronic component is mounted on a first surface of the mainboard, a through-current hole is disposed in a thickness direction of the mainboard, a hole wall of the through-current hole has a conductive medium, and the through-current hole is electrically connected to the electronic component. The current guiding structure is configured to be connected to a power supply, and is configured to transmit a power supply current output from the power supply, and the current guiding structure is disposed on a side of the mainboard, and is electrically connected to the hole wall of the through-current hole, to transmit the power supply current to the through-current hole in the thickness direction of the mainboard.