公开(公告)号：US20250151240A1

公开(公告)日：2025-05-08

申请号：US19016491

申请日：2025-01-10

Applicant: xFusion Digital Technologies Co., Ltd.

Inventor： Hui Jia ,  Guangjing Wang

IPC: H05K7/20 ,  H05K7/14

Abstract: A server and a server system are provided. The server system includes a server and a cooling medium distributing device. The server includes a first electronic node, a second electronic node, and a cooling connection device. The first electronic node and the second electronic node are connected with the cooling medium distributing device through the cooling connection device. The cooling medium distributing device conveys a liquid cooling medium of the same working medium to the first electronic node and the second electronic node, so that the first electronic component of the first electronic node can dissipate heat in a two-phase heat dissipation mode, and the second electronic component of the second electronic node can dissipate heat in a single-phase liquid cooling manner.

公开(公告)号：US20250142776A1

公开(公告)日：2025-05-01

申请号：US19004026

申请日：2024-12-27

Applicant: xFusion Digital Technologies Co., Ltd.

Inventor： Hui Jia ,  Guangjing Wang

IPC: H05K7/20

Abstract: The cooling medium distribution apparatus includes a first heat exchanger, a second heat exchanger, a liquid storage tank, and a delivery pump. An input end of the first runner is configured to allow a gaseous first cooling medium to flow in, and an output end of the first runner is in communication with an input end of the liquid storage tank. An output end of the liquid storage tank is configured to be in communication with an input end of the delivery pump, and an output end of the delivery pump is configured to allow a liquid first cooling medium to flow out. The second runner is used for flowing of a second cooling medium to exchange heat with the first cooling medium in the first runner. The second heat exchanger enables the second cooling medium in the third runner to exchange heat with the first cooling medium.

公开(公告)号：US20250040098A1

公开(公告)日：2025-01-30

申请号：US18918937

申请日：2024-10-17

Applicant: xFusion Digital Technologies Co., Ltd

Inventor： Hui Jia ,  Chenglong Wang ,  Guangbiao Zhang

IPC: H05K7/20 ,  G06F1/20

Abstract: This application provides a heat dissipation apparatus and an electronic device, to improve efficiency of heat conduction between the heat dissipation apparatus and hard disks and improve heat dissipation performance. The heat dissipation apparatus includes a heat sink and a plurality of heat conduction components. The plurality of heat conduction components are connected to the heat sink, and the plurality of heat conduction components are arranged at intervals. A plug interface is formed between two adjacent heat conduction components, and the plug interface is used for one hard disk to be plugged in.

公开(公告)号：US20250048600A1

公开(公告)日：2025-02-06

申请号：US18920248

申请日：2024-10-18

Applicant: xFusion Digital Technologies Co., Ltd.

Inventor： Chenglong Wang ,  Hui Jia

IPC: H05K7/20

Abstract: Embodiments of this application provide an electronic device and a server. The electronic device includes a housing, a hose, a mounting bracket, a sealing structure, a floating structure, and a first connector. One end of the hose is located in the housing, and the other end of the hose is located outside the housing and is in communication with the first connector. The hose is fixedly connected to the housing at the working medium through-flow hole. One end of the mounting bracket is fixedly connected to the housing, the floating structure is mounted on the other end of the mounting bracket, and the first connector is mounted on the floating structure. The floating structure is movably connected to the mounting bracket, and/or the first connector is movably connected to the floating structure. The requirement for position precision of a connector at the working medium through-flow hole can be reduced.