公开(公告)号：US20020005591A1

公开(公告)日：2002-01-17

申请号：US09464561

申请日：1999-12-16

Applicant: Charles W.C. Lin

Inventor： CHARLES W.C. LIN

IPC: H01L023/48

CPC classification number: H01L24/50 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes or apertures of which preformed strips or wires inside the via holes serve as the connections between the semiconductor device and substrate circuitry. The assembling steps may include attaching an integrated circuit (IC) chip or chips to a rigid or flexible substrate circuitry having a plurality of pre-formed strips extended from the patterned circuitry and hanging inside a plurality of through holes. These through holes are aligned and placed on top of the terminal pads so that the respective traces on the substrate can be connected with the respective input/output terminal pads of the IC chip through the leads inside the via holes. After attachment, electrically conductive material is subsequently connected to these leads to the IC terminal pads through electrolytic plating, electroless (chemical) plating or solder re-flow processes. The joining material can provide mechanical support as well as electrical continuity between IC chip and the circuitry of the substrate.

Abstract translation: 一种倒装芯片组件及其形成方法，包括具有多个通孔或孔的单层或多层基板，其中通孔内的预制条或导线用作半导体器件与衬底电路之间的连接。 组装步骤可以包括将集成电路（IC）芯片或芯片附接到具有从图案化电路延伸并且悬挂在多个通孔内的多个预成形条的刚性或柔性基板电路。 这些通孔对齐并放置在端子焊盘的顶部上，使得衬底上的各个迹线可以通过通孔内的引线与IC芯片的相应输入/输出端子焊盘连接。 附着后，导电材料随后通过电镀，无电镀（化学镀）或焊料回流工艺连接到这些引线到IC端子焊盘。 接合材料可以提供机械支撑以及IC芯片和基板的电路之间的电连续性。

公开(公告)号：US20020125581A1

公开(公告)日：2002-09-12

申请号：US09852821

申请日：2001-05-10

Applicant: Charles W.C. Lin.

Inventor： Charles W.C. Lin

IPC: H01L023/488 ,  H01L023/528

CPC classification number: H01L24/02 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2224/9202 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes which serve as the connection between the semiconductor device and substrate circuitry. The method of manufacturing the flip chip assembly includes the steps of attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of via holes. The via holes are aligned with the terminal pads so that the respective traces on the substrate can be connected to the respective terminal pads through the via holes. After attachment, the pre-deposited solder inside the via holes or on the terminal pads is re-flowed. This re-flow soldering process electrically connects the IC chip to the substrate. The solder can be deposited by plating, wave soldering, meniscus coating, and screen printing techniques.

公开(公告)号：US20020127772A1

公开(公告)日：2002-09-12

申请号：US09852824

申请日：2001-05-10

Applicant: Charles W.C. Lin.

Inventor： Charles W.C. Lin

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H01L24/02 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2224/9202 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A flip chip assembly, and methods of forming the same, including a single or multi-layer substrate having a plurality of via holes which serve as the connection between the semiconductor device and substrate circuitry. The method of manufacturing the flip chip assembly includes the steps of attaching an integrated circuit (IC) chip having a plurality of input/output terminal pads to a rigid or flexible substrate having a plurality of via holes. The via holes are aligned with the terminal pads so that the respective traces on the substrate can be connected to the respective terminal pads through the via holes. After attachment, the pre-deposited solder inside the via holes or on the terminal pads is re-flowed. This re-flow soldering process electrically connects the IC chip to the substrate. The solder can be deposited by plating, wave soldering, meniscus coating, and screen printing techniques.

Abstract translation: 倒装芯片组件及其形成方法，包括具有多个通孔的单层或多层衬底，其用作半导体器件和衬底电路之间的连接。 制造倒装芯片组件的方法包括将具有多个输入/输出端子焊盘的集成电路（IC）芯片附接到具有多个通孔的刚性或柔性基板的步骤。 通孔与端子焊盘对准，使得衬底上的各个迹线可以通过通孔连接到相应的端子焊盘。 附着后，通孔内或端子焊盘上的预沉积焊料被重新流动。 该回流焊接工艺将IC芯片电连接到基板。 可以通过电镀，波峰焊，弯月面涂层和丝网印刷技术来沉积焊料。