公开(公告)号：US09281104B2

公开(公告)日：2016-03-08

申请号：US14451444

申请日：2014-08-05

Applicant: Nano and Advanced Materials Institute Limited

Inventor： Caiming Sun

IPC: H01L21/84 ,  H01C7/04 ,  H01C17/065 ,  H01C1/14

CPC classification number: H01C7/048 ,  H01C1/14 ,  H01C7/049 ,  H01C17/0652 ,  H01C17/06586 ,  H01C17/06593

Abstract: A method of fabricating a temperature sensing device based on printed silicon-carbon nanocomposite film is disclosed. This method includes high-crystal-quality Si nanoparticles (NPs) homogeneously mixed with carbon NPs and Si—C nanocomposites printed as negative temperature coefficient (NTC) thermistor. These mixtures of Si and C NPs are formulated into screen printing paste with acrylic polymer binder and ethylene glycol (EG) as solvent. This composite paste can be successfully printed on flexible substrates, such as paper or plastics, eventually making printable NTC thermistors quite low-cost. Si and carbon powders have size range of 10 nanometers to 100 micrometers and are mixed together with weight ratios of 100:1 to 10:1. More carbon content, higher conductivity of printed Si—C nanocomposite films keeping similar sensitivity of high-quality Si NPs. With homogeneous distribution of carbon particles in printed films, electrons can tunnel from silicon to carbon and high-conductivity carbon microclusters enhanced hopping process of electrons in printed nanocomposite film. The measured sensitivity 7.23%/° C. of printed Si—C nanocomposite NTC thermistor is approaching the reported value of 8.0-9.5%/° C. for intrinsic silicon bulk material near room temperature, with the quite low resistance of 10 kΩ-100 kΩ. This NTC thermistor is quite suitable for low-cost readout circuits and the integrated systems target to be disposable temperature sensors.

Abstract translation: 公开了一种制造基于印刷硅 - 碳纳米复合膜的温度感测装置的方法。 该方法包括与碳NPs均匀混合的高品质Si纳米粒子（NPs）和作为负温度系数（NTC）热敏电阻印刷的Si-C纳米复合材料。 将这些Si和C NPs的混合物配制成具有丙烯酸聚合物粘合剂和乙二醇（EG）作为溶剂的丝网印刷浆料。 该复合糊剂可以成功地印刷在诸如纸或塑料的柔性基材上，最终使可印刷的NTC热敏电阻成本低廉。 Si和碳粉的尺寸范围为10纳米至100微米，并以100：1至10：1的重量比混合在一起。 印刷的Si-C纳米复合薄膜的碳含量越高，导电性越好，高质量的Si NPs具有相似的灵敏度。 随着印刷膜中碳粒子的均匀分布，电子可以从硅到碳，高导电性碳微团簇增强印刷纳米复合薄膜电子的跳跃过程。 印刷的Si-C纳米复合材料NTC热敏电阻的测量灵敏度为7.23％/℃接近室温附近的本征硅体材料的报告值为8.0-9.5％/℃，具有相当低的10kΩ/ 100 k＆OHgr; 该NTC热敏电阻非常适用于低成本读出电路，集成系统目标是一次性温度传感器。

公开(公告)号：US3964943A

公开(公告)日：1976-06-22

申请号：US528076

申请日：1974-11-29

Applicant: Niels Lervad Andersen

Inventor： Niels Lervad Andersen

IPC: F23Q7/22 ,  H01C7/04 ,  H05B3/64 ,  H05B3/66

CPC classification number: F23Q7/22 ,  H01C7/048 ,  H05B3/64 ,  Y10T29/49082

Abstract: The invention relates to an electrical resistor with a SiC body, particularly for ignition or heating purposes, and to a method of producing such electrical resistor.

Abstract translation: 本发明涉及具有SiC体的电阻器，特别是用于点火或加热目的，以及一种制造这种电阻器的方法。

公开(公告)号：US3454345A

公开(公告)日：1969-07-08

申请号：US3454345D

申请日：1967-03-02

Applicant: DANFOSS AS

Inventor： DYRE MORGENS

IPC: H01C7/04 ,  F23N5/00 ,  F23Q1/04 ,  F23Q7/12

CPC classification number: H01C7/048

公开(公告)号：US12014852B2

公开(公告)日：2024-06-18

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US07217374B2

公开(公告)日：2007-05-15

申请号：US10765927

申请日：2004-01-29

Applicant: Miho Watanabe ,  Masaki Hirakata ,  Kazunori Anazawa ,  Chikara Manabe ,  Kentaro Kishi ,  Taishi Shigematsu ,  Takashi Isozaki ,  Hiroyuki Watanabe ,  Shigeki Ooma ,  Shinsuke Okada

Inventor： Miho Watanabe ,  Masaki Hirakata ,  Kazunori Anazawa ,  Chikara Manabe ,  Kentaro Kishi ,  Taishi Shigematsu ,  Takashi Isozaki ,  Hiroyuki Watanabe ,  Shigeki Ooma ,  Shinsuke Okada

IPC: H01B1/04 ,  H01C8/00 ,  H01C7/10 ,  H01C7/13

CPC classification number: H01C7/008 ,  B82Y10/00 ,  B82Y30/00 ,  H01C7/048

Abstract: To provide a resistance element having an electric resistance body with excellent stability and a method of manufacturing the same. The resistance element includes an electric resistance body, on a base body surface, consisting of a carbon nanotube structure layer 14, which configures a mesh structure in which at least plural carbon nanotubes are cross-linked to one another. The method of manufacturing the resistance element includes: an applying step of applying the base body surface 12 with a liquid solution containing carbon nanotubes having functional groups; and a cross-linking step of forming the carbon nanotube structure layer 14, used as an electric resistance body, that configures a mesh structure in which the plural carbon nanotubes are cross-linked to one another through curing of the liquid solution after application.

Abstract translation: 提供具有稳定性优异的电阻体的电阻元件及其制造方法。 电阻元件包括由碳纳米管结构层14构成的基体表面上的电阻体，其构成至少多个碳纳米管彼此交联的网状结构。 制造电阻元件的方法包括：施加步骤，用包含具有官能团的碳纳米管的液体溶液涂覆基体表面12; 以及形成用作电阻体的碳纳米管结构层14的交联步骤，其通过在施加后固化液体溶液来形成多个碳纳米管彼此交联的网状结构。

公开(公告)号：US5488350A

公开(公告)日：1996-01-30

申请号：US178784

申请日：1994-01-07

Applicant: Mohammad Aslam ,  James V. Beck

Inventor： Mohammad Aslam ,  James V. Beck

IPC: H01C7/04 ,  H01L23/373 ,  H01L21/265

CPC classification number: H01C7/048 ,  H01L23/3732 ,  H01L2924/0002

Abstract: Novel structures are provided including laminated layers of the diamond film in different patterns for conducting, generating and/or absorbing thermal energy. In particular, a thermal sensor/heater is shown including a doped electrically conductive diamond film layer encapsulated by layers of undoped electrically insulative layers on a silicon wafer. Also, a GaAs/Si on diamond laminate structure is provided in which the diamond film acts as a substrate and a heat sink. Notably, the diamond film structures are characterized by their high thermal conductivity, high chemical resistance, and high hardness/wear resistance due to the properties of the diamond films.

Abstract translation: 提供新颖的结构，包括用于导电，产生和/或吸收热能的不同图案的金刚石膜的层压层。 具体地，示出了热传感器/加热器，其包括在硅晶片上由未掺杂的电绝缘层的层封装的掺杂导电金刚石膜层。 此外，提供了一种金刚石层叠结构的GaAs / Si，其中金刚石膜用作衬底和散热器。 值得注意的是，由于金刚石膜的性质，金刚石膜结构的特征在于其高导热性，高耐化学性和高硬度/耐磨性。

公开(公告)号：US11967444B2

公开(公告)日：2024-04-23

申请号：US17636286

申请日：2020-09-15

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Gerald Kloiber

IPC: H01C7/04 ,  G01K7/22 ,  H01C1/14 ,  H01C17/075

CPC classification number: H01C7/041 ,  G01K7/22 ,  H01C1/1413 ,  H01C7/048 ,  H01C17/075

Abstract: In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.

公开(公告)号：US20150262738A1

公开(公告)日：2015-09-17

申请号：US14451444

申请日：2014-08-05

Applicant: Nano and Advanced Materials Institute Limited

Inventor： Caiming SUN

IPC: H01C7/04 ,  H01C1/14

CPC classification number: H01C7/048 ,  H01C1/14 ,  H01C7/049 ,  H01C17/0652 ,  H01C17/06586 ,  H01C17/06593

Abstract: A method of fabricating a temperature sensing device based on printed silicon-carbon nanocomposite film is disclosed. This method includes high-crystal-quality Si nanoparticles (NPs) homogeneously mixed with carbon NPs and Si—C nanocomposites printed as negative temperature coefficient (NTC) thermistor. These mixtures of Si and C NPs are formulated into screen printing paste with acrylic polymer binder and ethylene glycol (EG) as solvent. This composite paste can be successfully printed on flexible substrates, such as paper or plastics, eventually making printable NTC thermistors quite low-cost. Si and carbon powders have size range of 10 nanometers to 100 micrometers and are mixed together with weight ratios of 100:1 to 10:1. More carbon content, higher conductivity of printed Si—C nanocomposite films keeping similar sensitivity of high-quality Si NPs. With homogeneous distribution of carbon particles in printed films, electrons can tunnel from silicon to carbon and high-conductivity carbon microclusters enhanced hopping process of electrons in printed nanocomposite film. The measured sensitivity 7.23%/° C. of printed Si—C nanocomposite NTC thermistor is approaching the reported value of 8.0-9.5%/° C. for intrinsic silicon bulk material near room temperature, with the quite low resistance of 10 kΩ-100 kΩ. This NTC thermistor is quite suitable for low-cost readout circuits and the integrated systems target to be disposable temperature sensors.

Abstract translation: 公开了一种制造基于印刷硅 - 碳纳米复合膜的温度感测装置的方法。 该方法包括与碳NPs均匀混合的高品质Si纳米粒子（NPs）和作为负温度系数（NTC）热敏电阻印刷的Si-C纳米复合材料。 将这些Si和C NPs的混合物配制成具有丙烯酸聚合物粘合剂和乙二醇（EG）作为溶剂的丝网印刷浆料。 该复合糊剂可以成功地印刷在诸如纸或塑料的柔性基材上，最终使可印刷的NTC热敏电阻成本低廉。 Si和碳粉的尺寸范围为10纳米至100微米，并以100：1至10：1的重量比混合在一起。 印刷的Si-C纳米复合薄膜的碳含量越高，导电性越好，高质量的Si NPs具有相似的灵敏度。 随着印刷膜中碳粒子的均匀分布，电子可以从硅到碳，高导电性碳微团簇增强印刷纳米复合薄膜电子的跳跃过程。 印刷的Si-C纳米复合材料NTC热敏电阻的测量灵敏度为7.23％/℃接近室温附近的本征硅体材料的报告值为8.0-9.5％/℃，具有相当低的10kΩ/ 100 k＆OHgr; 该NTC热敏电阻非常适用于低成本读出电路，集成系统目标是一次性温度传感器。

公开(公告)号：US20030026991A1

公开(公告)日：2003-02-06

申请号：US10219215

申请日：2002-08-13

Applicant: EMC TECHNOLOGY, INC.

Inventor： Rajendra Shah ,  Joseph B. Mazzochette ,  Martin A. Helfand

IPC: B32B009/00

CPC classification number: H01C17/0652 ,  H01C1/084 ,  H01C7/048 ,  H01L23/3732 ,  H01L27/013 ,  H01L27/016 ,  H01L2924/0002 ,  Y10T428/265 ,  Y10T428/30 ,  H01L2924/00

Abstract: A substrate having a diamond or diamond-like carbon coating of at least one micron thickness on an underlayer of an insulating material such as AlN. Such a substrate is advantageously used as a mounting for passive electrical components such as microwave and radio-frequency (rf) resistors, capacitors, attenuators, terminators and loads.

Abstract translation: 在绝缘材料如AlN的底层上具有至少一微米厚度的金刚石或类金刚石碳涂层的基底。 这种衬底有利地用作无源电气部件如微波和射频（rf）电阻器，电容器，衰减器，终端器和负载的安装。

公开(公告)号：US4276535A

公开(公告)日：1981-06-30

申请号：US125231

申请日：1980-02-27

Applicant: Tsuneo Mitsuyu ,  Kiyotaka Wasa ,  Shigeru Hayakawa

Inventor： Tsuneo Mitsuyu ,  Kiyotaka Wasa ,  Shigeru Hayakawa

IPC: H01C7/04

CPC classification number: H01C7/041 ,  H01C7/048

Abstract: A high performance, precision thermistor comprising a temperature sensitive resistor in the form of a thin, uniform layer of silicon carbide, deposited on a base support by sputtering, and electrode means attached to the temperature sensitive resistor in electrically connected relation to the temperature sensitive resistor.

Abstract translation: 一种高性能精密热敏电阻，其包括通过溅射沉积在基底支撑件上的薄均匀碳化硅层形式的温度敏感电阻器，以及连接到温度敏感电阻器的温度敏感电阻器，该温度敏感电阻器与温度敏感电阻器电连接 。