公开(公告)号：US20150118950A1

公开(公告)日：2015-04-30

申请号：US14582682

申请日：2014-12-24

Applicant: Ortronics, Inc.

Inventor： Lars R. Larsen ,  Stewart A. Levesque

IPC: H05K7/20

CPC classification number: H05K7/20572 ,  F24F13/00 ,  H04Q1/035 ,  H04Q1/062 ,  H04Q1/09 ,  H04Q2201/02 ,  H04Q2201/06 ,  H05K7/20 ,  H05K7/20709

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape. A cable management system includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.

公开(公告)号：US07778597B2

公开(公告)日：2010-08-17

申请号：US11739523

申请日：2007-04-24

Applicant: Eric Sit ,  Robin Berg, Jr. ,  Brian J. McClellan ,  Steven Skradde ,  David J. Streitz ,  John P. Anderson ,  Gary L. Steinkogler ,  Eric Comer

Inventor： Eric Sit ,  Robin Berg, Jr. ,  Brian J. McClellan ,  Steven Skradde ,  David J. Streitz ,  John P. Anderson ,  Gary L. Steinkogler ,  Eric Comer

IPC: H04B7/15

CPC classification number: H04B1/03 ,  H04B1/036 ,  H04B1/08 ,  H04B7/155 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/02 ,  H04Q2201/06 ,  H04Q2201/12

Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.

Abstract translation: 公开了一种用于具有包括STM-1（155.52兆比特每秒）的数据速率的信号的电信底盘，模块和中继器电路。 底盘提供用于为其所包含的电路模块建立屏蔽和散热的结构，包括具有用于循环空气的集成通风模式的外部和内部法拉第箱。 该模块提供自己的结构，用于建立屏蔽和散热，包括法拉第箱和通风模式。 中继器电路提供通过多个放大级和电路板结构在一个器件的监视器插孔和另一个器件的较高信号电平输入插孔之间桥接数据信号的能力。 电信机箱，模块和中继器电路可以结合使用。

公开(公告)号：US07310234B2

公开(公告)日：2007-12-18

申请号：US10988145

申请日：2004-11-12

Applicant: William Miller ,  Kelly Johnson

Inventor： William Miller ,  Kelly Johnson

IPC: H05K5/00

CPC classification number: H05K7/186 ,  H04M19/00 ,  H04Q1/023 ,  H04Q1/026 ,  H04Q1/035 ,  H04Q1/06 ,  H04Q1/116 ,  H04Q2201/02 ,  H04Q2201/06 ,  H04Q2201/10

Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radiofrequency (RF) management system and e) a bottom panel coupled to the frame system.

Abstract translation: 现在设计了远程外壳系统，以满足以下目标：a）在一个系统中整合电气终端; b）在现场安装之前预先终止交流和直流设备负载; c）提供多个接入点，便于设备维修和安装; d）通过使用可容纳各种定制侧板或各种扩展柜的附件的模块化框架设计，可以轻松配置和扩展; e）鉴于电缆入口和路由结构，具有美观功能; f）提供卓越的热管理，并且g）减少常规电子设置中固有的问题。 涵盖的远程外壳系统通常包括：a）还包括至少两个侧板的框架系统; b）至少一个联接到所述框架系统的门; c）耦合到所述框架系统的电缆管理顶部组件; d）至少一个可移动射频（RF）管理系统，以及e）耦合到所述框架系统的底板。

公开(公告)号：US20070127212A1

公开(公告)日：2007-06-07

申请号：US11456270

申请日：2006-07-10

Applicant: Gary Gustine ,  Charles Ham ,  Michael Sawyer ,  Fredrick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

Inventor： Gary Gustine ,  Charles Ham ,  Michael Sawyer ,  Fredrick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

IPC: H05K7/20

CPC classification number: H05K7/20409 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/20418 ,  H05K7/20445

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract translation: 用于容纳诸如电子电路卡的物体的装置及其制造方法，该装置具有壳体; 设置在所述壳体内的至少一个壳体，所述壳体适于将所述物体限制在所述壳体内的不同位置并且包括框架，所述框架内的所述区域由第一分区分成两个区域，所述两个区域中的每一个被划分为多个 通过多个第二分区，每个第二分区热耦合到框架和第一分区，每个部分被划分成多个狭槽，每个狭槽具有设置在其中的物体，用于在第一分隔件之间进行热接触， 第二分区，以及第二分区和所述帧中的一个; 以及至少一个适于从壳体吸收热量的散热器，所述散热器热耦合到壳体和壳体。

公开(公告)号：US06907230B2

公开(公告)日：2005-06-14

申请号：US09812226

申请日：2001-03-19

Applicant: Eric Sit ,  Robin Berg, Jr. ,  Brian McClellan ,  Steven Skradde ,  David Streitz ,  John Anderson ,  Gary L. Steinkogler ,  Eric Comer

Inventor： Eric Sit ,  Robin Berg, Jr. ,  Brian McClellan ,  Steven Skradde ,  David Streitz ,  John Anderson ,  Gary L. Steinkogler ,  Eric Comer

IPC: H04B1/036 ,  H04B1/08 ,  H04Q1/02 ,  H04B1/38

CPC classification number: H04B1/03 ,  H04B1/036 ,  H04B1/08 ,  H04B7/155 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/02 ,  H04Q2201/06 ,  H04Q2201/12

Abstract: A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.

公开(公告)号：US20040163552A1

公开(公告)日：2004-08-26

申请号：US10673739

申请日：2003-09-29

Applicant: ADC Telecommunications, Inc.

Inventor： Gary Gustine ,  Charles G. Ham ,  Michael Sawyer ,  Frederick Daniels ,  Michelle Bishop ,  Lane King ,  Matthew Kusz

IPC: A23B004/14

CPC classification number: H05K7/20409 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/20418 ,  H05K7/20445

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract translation: 用于容纳诸如电子电路卡的物体的装置及其制造方法，该装置具有壳体; 设置在所述壳体内的至少一个壳体，所述壳体适于将所述物体限制在所述壳体内的不同位置并且包括框架，所述框架内的所述区域由第一分区分成两个区域，所述两个区域中的每一个被划分为多个 通过多个第二分区，每个第二分区热耦合到框架和第一分区，每个部分被划分成多个狭槽，每个狭槽具有设置在其中的物体，用于在第一分隔件之间进行热接触， 第二分区，以及第二分区和所述帧中的一个; 以及至少一个适于从壳体吸收热量的散热器，所述散热器热耦合到壳体和壳体。

公开(公告)号：US06675976B2

公开(公告)日：2004-01-13

申请号：US10114510

申请日：2002-04-01

Applicant: Joseph Steinman ,  Greg Lowe

Inventor： Joseph Steinman ,  Greg Lowe

IPC: A47F500

CPC classification number: H05K7/20581 ,  H04Q1/023 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q1/10 ,  H04Q1/116 ,  H04Q2201/02 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12

Abstract: A rack assembly includes a nineteen-inch sub-assembly coupled to a four-inch extension that comprises two substantially closed side panels adjacent to each other, two substantially open sides adjacent to each other, a closed top and bottom, a plurality of mounting flanges for attaching the extension to a nineteen-inch sub-assembly and a plurality of embossments for receiving mounting hardware for installing the sub-assembly and extension into a twenty-three-inch rack. The four-inch extension is formed not only to allow a nineteen-inch rack sub-assembly to be installed in a twenty-three-inch rack, but also is formed to conduct air exhausted from a side of the nineteen-inch sub-assembly towards a rear end of the twenty-three-inch rack.

Abstract translation: 机架组件包括联接到四英寸延伸部的十九英寸子组件，其包括彼此相邻的两个基本上封闭的侧板，彼此相邻的两个基本上敞开的侧面，封闭的顶部和底部，多个安装凸缘 用于将延伸件附接到十九英寸子组件和用于接收用于将子组件和扩展件安装到二十三英寸机架中的安装硬件的多个压花。 形成四英寸的延伸部不仅可以将十九英寸的机架子组件安装在二十三英寸机架中，而且还形成为将从十九英寸子组件的一侧排出的空气 朝向二十三英寸机架的后端。

公开(公告)号：US20030146679A1

公开(公告)日：2003-08-07

申请号：US10067718

申请日：2002-02-07

Inventor： Paul A. Gliesman ,  Thomas W. Re ,  Thomas C. Giles ,  Juzer Mohammed ,  Wayne F. Peters

IPC: A47F003/04

CPC classification number: H05K7/1424 ,  H04Q1/035 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12

Abstract: A chassis arrangement that minimizes lateral flame spread from card to card within the chassis, and increases heat dissipation from the chassis, comprising a heat sink attached to the inside of the chassis cover to dissipate excess heat from within the chassis, and PCB shields disposed between the circuit cards of the chassis and acting in concert with the heat sink to act as physical and thermal barriers to prevent lateral flame spread from card to card due to flame and hot gas wrap-around.

Abstract translation: 一种底盘装置，其最小化从底板内的卡到卡的侧向火焰蔓延，并且增加从底盘的散热，包括附接到底盘盖内部的散热片，以散发来自底盘内的多余的热量，以及布置在 底盘的电路卡与散热器协调工作，作为物理和热障，以防止由于火焰和热气体环绕而引起卡片卡到卡片的侧向火焰蔓延。

公开(公告)号：US20020051532A1

公开(公告)日：2002-05-02

申请号：US09935586

申请日：2001-08-24

Inventor： Douglas B. Cross ,  John C. Atkinson ,  Marko Nicolici ,  Kalvin W. Korpela ,  Roger D. Carroll

IPC: H04M001/00

CPC classification number: H04Q1/09 ,  H04Q1/035 ,  H04Q1/06 ,  H04Q2201/02 ,  H04Q2201/04 ,  H04Q2201/06 ,  H04Q2201/14

Abstract: The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface. Further the telecommunications system includes a coolant movement means for moving a coolant through the coolant stream passages and across the rack interface plane. As such, the coolant convects heat away from the cooling surfaces of electronics modules more efficiently and effectively than found in the prior art as it, amongst other things, shortens the distance over which the inlet coolant is required to travel to cool the same functional density and provides a coolant to the passage at approximately a uniform temperature for each module.

Abstract translation: 本发明涉及一种电信系统，其包括限定核心架，服务平面和机架接口平面的模块架，其中服务平面横向于机架接口平面。 核心托架部分受服务平面和机架接口平面的限制。 电信系统还包括一系列电子模块，每个电子模块限定电子定向平面，其中每个模块包括基本上平行于电子定向平面定向的两个相对的冷却表面。 电子模块中的每一个可移除地固定在核心托架内。 电子模块的这一系列形成阵列，使得其电子定向平面基本上垂直于机架接口平面和维修平面。 阵列还限定穿过每个冷却表面的至少一个冷却剂流通道。 此外，电信系统包括用于使冷却剂移动通过冷却剂流通道并穿过机架接口平面的冷却剂移动装置。 因此，除了别的以外，冷却剂可以比现有技术中更加有效和有效地将冷却剂从电子模块的冷却表面散热离开冷却表面，这尤其缩短了入口冷却剂需要行进以冷却相同功能密度的距离 并为每个模块以大致均匀的温度向通道提供冷却剂。

公开(公告)号：US06341064B1

公开(公告)日：2002-01-22

申请号：US09541410

申请日：2000-03-31

Applicant: Eddie R. Bradley

Inventor： Eddie R. Bradley

IPC: H05K720

CPC classification number: H05K7/20572 ,  H02B1/565 ,  H04M2207/12 ,  H04Q1/025 ,  H04Q1/035 ,  H04Q1/10 ,  H04Q2201/06 ,  H05K7/207

Abstract: The compact PCI cabinet includes an inlet port for receiving external air, a set of blowers for drawing the air into the cabinet and for expelling the air from an exhaust port of the cabinet after having cooled internal active circuits, and a plurality of louvers and openings that create thermal convection within a back portion of the compact PCI cabinet to cool active components coupled to the back side of the back plain of the compact PCI system. Additionally, a plurality of perforated air openings located approximately at the bottom and back side of a side panel of the compact PCI cabinet also is included to conduct an receive some air from the external environment. Openings are formed between a plurality of card guides located approximately at the top of the back side of the back portion of the PCI cabinet for conducting air in and out of the back portion of the cabinet. A pin field coupled to a heat sink is placed in the air path between the blowers and the openings through which the air may be conducted into the back portion of the compact PCI cabinet to reduce the exhaust air temperature. Finally, the invention includes a thermistor placed in the exhaust path so that the fan speed of the blowers maybe adjusted according to the temperature of the exhaust after passing through the pin field.

Abstract translation: 紧凑型PCI机箱包括用于接收外部空气的入口端口，一组用于将空气抽入机壳的鼓风机，以及在具有冷却内部有源电路之后将空气从机柜的排气口排出的多个百叶窗和开口 其在紧凑型PCI机箱的后部部分内产生热对流，以冷却耦合到紧凑型PCI系统的背面的背面的有源部件。 此外，还包括大致位于紧凑型PCI机箱的侧板的底侧和后侧的多个穿孔空气开口，以从外部环境接收一些空气。 开口形成在大致位于PCI机箱背部的后侧顶部的多个卡片导向件之间，用于将空气导入和移出机壳的后部。 耦合到散热器的销场被放置在鼓风机和开口之间的空气路径中，空气可以通过该空气通道进入紧凑型PCI机箱的后部，以减少排气温度。 最后，本发明包括放置在排气路径中的热敏电阻，使得鼓风机的风扇速度可以根据通过销场的排气温度进行调节。