Abstract:
To provide an apparatus and method for forming a thin-film using raw material fluid containing a film ingredient and supercritical fluid or liquid. An apparatus according to the present invention is used for forming a thin-film using raw material fluid containing alcohol, supercritical fluid or liquid carbon dioxide, and a condensation polymer containing an element of a target metal oxide compound. This apparatus includes a substrate holder 2 for retaining a substrate 3, a film-forming chamber 1 for housing the substrate holder, a feeding means for feeding the raw material fluid to the substrate surface, and a lamp heater 4 for heating the substrate 3 retained to the substrate holder 2. Thereby, the thin-film can be formed using the raw material fluid containing a film ingredient and the supercritical fluid or liquid.
Abstract:
The present invention provides a method and a device, by which it is possible to decompose and treat a large amount of organic halogen compounds, etc. which are environmental pollutants, to a low concentration range at which it is dischargeable as waste liquor to sewage in a short time, and it is also possible to decompose organic substances and nitrogen or phosphorus compounds which are hardly decomposable by oxidation. To a sample solution 20 contained in a reaction vessel 10a in which an aqueous solution containing environmental pollutants is stored, for example, ultrasonic waves 50 are irradiated from a transducer 30a disposed at the central bottom portion of the reaction vessel 10a, and at the same time, ultraviolet rays are irradiated from an ultraviolet lamp 40a disposed at the peripheral edge of the reaction vessel 10a. In this instance, the ultraviolet lamp 40a is disposed at a position such that it does not interfere with the path of travel of ultrasonic waves 50.
Abstract:
A system and method for wet cleaning a semiconductor wafer utilizes a nozzle assembly to combine two or more input fluids to form a cleaning fluid at the point-of-use. The input fluids are received at the nozzle assembly and combined in a chamber of the nozzle assembly to form the cleaning fluid. The nozzle assembly may include an acoustic transducer to generate an acoustic energy, one or more valves, e.g., three-way valves, to control the receipt of input fluids and/or a flow control mechanism, e.g., a pressure spring valve, to control dispensing of the cleaning fluid onto a surface of the semiconductor wafer.