Method and device for decomposing environmental pollutants
    2.
    发明申请
    Method and device for decomposing environmental pollutants 审中-公开
    分解环境污染物的方法和装置

    公开(公告)号:US20040170538A1

    公开(公告)日:2004-09-02

    申请号:US10473644

    申请日:2004-04-15

    Abstract: The present invention provides a method and a device, by which it is possible to decompose and treat a large amount of organic halogen compounds, etc. which are environmental pollutants, to a low concentration range at which it is dischargeable as waste liquor to sewage in a short time, and it is also possible to decompose organic substances and nitrogen or phosphorus compounds which are hardly decomposable by oxidation. To a sample solution 20 contained in a reaction vessel 10a in which an aqueous solution containing environmental pollutants is stored, for example, ultrasonic waves 50 are irradiated from a transducer 30a disposed at the central bottom portion of the reaction vessel 10a, and at the same time, ultraviolet rays are irradiated from an ultraviolet lamp 40a disposed at the peripheral edge of the reaction vessel 10a. In this instance, the ultraviolet lamp 40a is disposed at a position such that it does not interfere with the path of travel of ultrasonic waves 50.

    Abstract translation: 本发明提供一种方法和装置,通过该方法和装置,可以将大量作为环境污染物的有机卤素化合物等分解和处理至低浓度范围,作为废液排放到污水中 短时间,也可以分解通过氧化难以分解的有机物质和氮或磷化合物。 存储在其中储存有环境污染物的水溶液的反应容器10a中的样品溶液20例如从设置在反应容器10a的中央底部的换能器30a照射超声波50, 时间,从设置在反应容器10a的周缘的紫外灯40a照射紫外线。 在这种情况下,紫外线灯40a设置在不干扰超声波50的行进路径的位置。

    Nozzle assembly, system and method for wet processing a semiconductor wafer
    3.
    发明申请
    Nozzle assembly, system and method for wet processing a semiconductor wafer 审中-公开
    用于湿加工半导体晶片的喷嘴组件,系统和方法

    公开(公告)号:US20040062874A1

    公开(公告)日:2004-04-01

    申请号:US10219967

    申请日:2002-08-14

    CPC classification number: H01L21/67051

    Abstract: A system and method for wet cleaning a semiconductor wafer utilizes a nozzle assembly to combine two or more input fluids to form a cleaning fluid at the point-of-use. The input fluids are received at the nozzle assembly and combined in a chamber of the nozzle assembly to form the cleaning fluid. The nozzle assembly may include an acoustic transducer to generate an acoustic energy, one or more valves, e.g., three-way valves, to control the receipt of input fluids and/or a flow control mechanism, e.g., a pressure spring valve, to control dispensing of the cleaning fluid onto a surface of the semiconductor wafer.

    Abstract translation: 用于湿式清洁半导体晶片的系统和方法利用喷嘴组件来组合两个或更多个输入流体以在使用点形成清洁流体。 输入流体在喷嘴组件处被接收并且组合在喷嘴组件的腔室中以形成清洁流体。 喷嘴组件可以包括用于产生声能的声换能器,一个或多个阀,例如三通阀,以控制输入流体的接收和/或流量控制机构,例如压力弹簧阀,以控制 将清洁流体分配到半导体晶片的表面上。

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