公开(公告)号：US06406748B2

公开(公告)日：2002-06-18

申请号：US09782411

申请日：2001-02-13

Applicant: Theodore D. Held, III ,  William E. Fristad

Inventor： Theodore D. Held, III ,  William E. Fristad

IPC: B05D308

CPC classification number: B05D3/08 ,  B05D1/18 ,  B05D3/12

Abstract: Method for preventing the formation of coating defects in polymeric coated surfaces in a coating process comprising a plurality of steps that occur prior to the polymeric coating of said surfaces and that contact organic and metal surfaces with a plurality of aqueous compositions in which accumulate in suspension resin particles released from said metal surfaces. Suspended resin particles are prevented from re-depositing on the organic surfaces by converting said surfaces to hydrophilic character by means of oxidizing said surfaces prior to contacting the oxidized surfaces with said suspensions.

Abstract translation: 一种用于防止在涂覆方法中在聚合物涂覆表面形成涂层缺陷的方法，包括在所述表面的聚合物涂覆之前发生的多个步骤，并且与多个含水组合物接触有机和金属表面，其中积聚在悬浮树脂 从所述金属表面释放的颗粒。 通过在将氧化的表面与所述悬浮液接触之前，通过氧化所述表面将所述表面转化为亲水特性来防止悬浮的树脂颗粒在有机表面上再沉积。

公开(公告)号：US06368398B2

公开(公告)日：2002-04-09

申请号：US09766352

申请日：2001-01-19

Applicant: Brian A. Vaartstra

Inventor： Brian A. Vaartstra

IPC: B05D308

CPC classification number: H01L21/31691 ,  C23C16/40 ,  C23C16/4486

Abstract: A method of forming a film on a substrate using chemical vapor deposition techniques and carboxylate complexes. The complexes and method are particularly suitable for the preparation of semiconductor structures.

Abstract translation: 使用化学气相沉积技术和羧酸盐络合物在基材上形成膜的方法。 络合物和方法特别适用于半导体结构的制备。

公开(公告)号：US06217645B1

公开(公告)日：2001-04-17

申请号：US09388667

申请日：1999-09-02

Applicant: Brian A. Vaartstra

Inventor： Brian A. Vaartstra

IPC: B05D308

CPC classification number: H01L21/31691 ,  C23C16/40 ,  C23C16/4486

Abstract: A method of forming a film on a substrate using chemical vapor deposition techniques and carboxylate complexes. The complexes and method are particularly suitable for the preparation of semiconductor structures.

Abstract translation: 使用化学气相沉积技术和羧酸盐络合物在基材上形成膜的方法。 络合物和方法特别适用于半导体结构的制备。

公开(公告)号：US06706320B2

公开(公告)日：2004-03-16

申请号：US09780623

申请日：2001-02-12

Applicant: Con Filippou ,  Wojciech S Gutowski ,  David Proctor ,  Mark Spicer

Inventor： Con Filippou ,  Wojciech S Gutowski ,  David Proctor ,  Mark Spicer

IPC: B05D308

CPC classification number: B05D3/08 ,  B05D2201/00

Abstract: A process for modifying the surface of a substrate containing a polymeric material by contacting the surface with the modifying agent to bond the modifying agent to the surface the process comprising providing a solution of the modifying agent in a solvent and subjecting the solution of the modifying agent to a zone of elevated temperature to vaporize the solvent and provide diffuse contact between the modifying agent and the surface of the substrate.

Abstract translation: 一种通过使表面与改性剂接触来改性含有聚合物材料的基材的表面的方法，以将改性剂粘合到表面上，该方法包括提供改性剂在溶剂中的溶液并使改性剂的溶液 到高温区域以蒸发溶剂并提供改性剂与基材表面之间的扩散接触。