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CN101574024A 电子部件内置布线板以及电子部件内置布线板的散热方法 失效 - 权利终止 复审申请

  • Patent Title: 电子部件内置布线板以及电子部件内置布线板的散热方法
  • Patent Title (English): Electronic parts built-in distributing board, and radiating method for the electronic parts built-in distributing board
  • Application No.: CN200780046529.5
    Application Date: 2007-12-14
  • Publication No.: CN101574024A
    Publication Date: 2009-11-04
  • Inventor: 笹冈贤司 , 福冈义孝
  • Applicant: 大日本印刷株式会社
  • Applicant Address: 日本东京都
  • Assignee: 大日本印刷株式会社
  • Current Assignee: 大日本印刷株式会社
  • Current Assignee Address: 日本东京都
  • Agency: 永新专利商标代理有限公司
  • Agent 杨谦; 胡建新
  • Priority: 339689/2006 2006.12.18 JP; 319474/2007 2007.12.11 JP
  • International Application: PCT/JP2007/074152 2007.12.14
  • International Announcement: WO2008/075629 JA 2008.06.26
  • Date entered country: 2009-06-16
  • Main IPC: H05K3/46
  • IPC: H05K3/46
电子部件内置布线板以及电子部件内置布线板的散热方法
Abstract:
电子部件内置布线板具备至少一对布线图案、保持在上述一对布线图案间的绝缘构件以及埋设在上述绝缘构件中的电子部件，在上述绝缘构件中的上述电子部件的至少主面上形成与上述电子部件热连接的金属体，将从上述电子部件发出的热散出。
Abstract(English):

Provided is an electronic parts built-in distributing board comprising at least a pair of wiring patterns, an insulating member held between the paired wiring patterns, and electronic parts buried in the insulating member. On at least principal face of the electronic parts in the insulating member, a metal member connected thermally with the electronic parts is formed to irradiate the heat emitted from the electronic parts.

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