An inline-type wafer conveyance device is provided with a load chamber (51) for carrying in a wafer from outside, an unload chamber (53) for carrying out the wafer outside, a plurality of conveyance chambers (54a, 54b and 54c) and a plurality of process modules (52a and 52b), which are connected in series between the load chamber and the unload chamber. The conveyance chambers and the process modules are alternately connected. A plurality of the conveyance chambers are provided with the first end conveyance chamber (54a) connected to the load chamber, the second end conveyance chamber (54c) connected to the unload chamber and one or a plurality of intermediate conveyance chambers (54b).