A method of producing a semiconductor chip stack, comprising: a coating step (1) of coating a substrate or another semiconductor chip with a semiconductor-component-use adhesive; a semiconductor chip stacking step (2) of stacking a semiconductor chip by means of the coated semiconductor-component-use adhesive; a step (3) of evenly spreading the semiconductor-component-use adhesive on the entire region on the substrate or the other semiconductor chip where the semiconductor chip is bonded; and a curing step (4) of curing the semiconductor-component-use adhesive. In the coating step (1), the region coated by the semiconductor-component-use adhesive is 40 to 90% of the region where the semiconductor chip is bonded. The region where the semiconductor-component-use adhesive has spread immediately after the semiconductor chip stacking step (2) is at least 60% and less than 100% of the region where the semiconductor chip is bonded. In the spreading step (3), the viscosity of the semiconductor-component-use adhesive at 0.5 rpm according to an E-type viscosity meter is 1 to 30 Pas.