A substrate cleaning apparatus for reducing a limitation of a layout of a chemical liquid nozzle and a rinsing liquid nozzle, while enabling a load cell to be installed at an optimal location and achieving a larger adjustment range, is disclosed. The substrate cleaning apparatus includes a roll assembly including at least a roll cleaning member to be brought into contact with a substrate and a roll arm that rotatably supports the roll cleaning member, a support arm for supporting the roll assembly; an adjustment screw extending through the support arm and screwed into the roll assembly; and a screw support that fixes a relative position of the adjustment screw in a vertical direction with respect to the support arm and rotatably supports the adjustment screw.