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Invention Grant
CN105874590B 双侧式管芯封装件 有权

双侧式管芯封装件
Abstract:
一种设备包括：管芯，所述管芯的第一侧包括第一类型的系统级触点并且第二侧包括第二类型的触点；以及封装基板，所述封装基板耦接到所述管芯和所述管芯的所述第二侧。一种设备包括：管芯，所述管芯的第一侧包括多个系统级逻辑触点并且第二侧包括第二多个系统级电力触点。一种方法包括将管芯的第一侧上的第一类型的系统级触点和管芯的第二侧上的第二类型的系统级触点中的一者耦接到封装基板。
Abstract(English):

An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.

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