The invention provides a fan-out type packaging structure. The fan-out type packaging structure comprises a chip, bumps, a plastic package material, re-wiring layers and welding balls; the chip is provided with a top surface, side surfaces and a bottom surface; the bumps are positioned on the top surface of the chip; the plastic packaging material packages the side surfaces of the chip, and cover the top surface, beyond the positions of the bumps, of the chip; the re-wiring layers are arranged on the top surface of the plastic packaging material and the top surfaces of the bumps and are electrically connected with the bumps; the re-wiring layers comprise bonding pads arranged thereon; the welding balls are positioned on the bonding pads of the re-wiring layers and are electrically connected with the re-wiring layers through the bonding pads.