The invention discloses a bare chip structure applied to testing and a manufacturing method thereof. The structure 100 comprises a main PCB 101, an auxiliary PCB 102, a bare chip 103, bonding pads 104/106, bonding wires 105/107, a gasket 110, a metal inserting pin 111, a protection cover 112 and electrical insulation oil 114, wherein the gasket 110 is bonded onto the PCB 101, and the bare chip 103 is bonded onto the gasket 110; the bonding pad 104 is arranged around the periphery of the bare chip 103, is arranged on the main PCB 101, and is connected with a metal PAD of the bare chip 103 through the bonding wire 105; the auxiliary PCB 102 is positioned on the periphery of the bonding pad 104, is bonded onto the main PCB 101, and is electrically connected with the main PCB 101 through the metal inserting pin 111; the bonding pad 106 is arranged on the auxiliary PCB 102, and is connected with the metal PAD of the bare chip 103 through the bonding wire 107; the protection cover 112 is bonded onto the main PCB 101, and the electrical insulation oil 114 is injected into the interior of the protection cover 112. In the invention, the structure is in the shape of a high-low-high step, so that the density of the bonding wires in unit area is improved, the metal PAD can be prevented from being polluted when the bare chip is bonded, and the bare chip and the bonding wires are prevented from being oxidized in air.