The invention discloses a packaging process and a packaging substrate for the same. The packaging substrate comprises a dielectric layer, a first wiring layer provided on the dielectric layer, and a support plate bonded to the dielectric layer and the first line layer through an insulating layer; adhesiveness of the insulating layer can be restored after the insulating layer is soaked in a solvent, the support plate and the insulating layer can be reused after packaging processes of the packaging substrate are completed, and the support plate can be prevented from being wasted.