The invention provides an electronic component package body and a manufacturing method thereof. The electronic component package body comprises a flexible substrate, a first line structure, a first electronic component and a thermoplastic film with a second line structure. The first line structure is arranged on the flexible substrate. The first electronic component is arranged on the flexible substrate. The first electronic component is separated from the first line structure. The thermoplastic film is welded to the flexible substrate, and the first electronic component is sealed. The second line structure electrically connects the first line structure and the first electronic component. The electronic component package body has the advantage of low production cost.