The present invention relates to a light-emitting diode package, and the present invention provides a light-emitting diode package comprising: a substrate having one or more first pads, one or more second pads, a first terminal, and a second terminal, which are all formed on the upper surface; a plurality of light-emitting diode chips loaded on the one or more first pads and electrically connectedto the first pad and the second pad; and a reflector coupled to an upper part of the substrate and having an opening part through which the plurality of light-emitting diode chips is exposed, whereinthe first pad is formed as one body with the substrate, the first terminal or the second terminal is connected to an external power source and formed to have a predetermined height at the upper surface of the substrate. According to the present invention, the plurality of light-emitting diode chips is directly loaded as an array on the substrate, and the reflector is formed so as to surround theplurality of light-emitting diode chips, such that the plurality of light-emitting diode chips is protected by the reflector.