The invention provides an encapsulation stack structure which includes a first encapsulation structure and a second encapsulation structure. The first encapsulation structure includes a first supportplate, a first chip, a first insulation sealing body, conducting structures, a crystal seed layer and a line layer. Support plate connection pads, the first chip, the first insulation sealing body andthe conducting structures are located at a first surface of the support plate. The first insulation sealing body includes first open holes and trenches. The first insulation sealing body includes encapsulation glue and filling materials and metal salts that dispersed in the encapsulation glue. The crystal seed layer includes metal reduced by the metal salts and is arranged at the surfaces of thefirst open holes and the trenches. The line layer is disposed on the crystal seed layer. The second encapsulation structure is in electric connection with the line layer. In addition, the invention also provides a manufacture method of the encapsulation stack structure.