The invention provides a conductive column forming method, a packaging structure and a packaging method. According to the invention, a groove with a large depth is formed in a first substrate, then aconductive layer is formed in the groove, the conductive layer in the first substrate is bonded to a second substrate in combination with the bonding process, and the first substrate is removed to expose the conductive layer to form the conductive column, so that the conductive column with a large height can be formed. In the packaging process, the conductive column has a relatively large height,so that it can be ensured that the conductive column can be welded to a target welding pad by crossing a bulge structure.