The invention relates to a semiconductor packaging structure. The semiconductor packaging structure comprises an internal connecting substrate, insulating glue, an instantaneous voltage suppression chip, at least one first conductive wire and at least one second conductive wire. The inner connecting substrate comprises a bottom layer and a top layer, the bottom layer comprises two first conductiveblocks and a first insulating block between the two first conductive blocks, and the top layer comprises two second conductive blocks and a second insulating block between the two second conductive blocks. The two second conductive blocks are respectively arranged on the two first conductive blocks, and the second insulating blocks are arranged on the first insulating blocks. The insulating glueis arranged on the second insulating blocks. The instantaneous voltage suppression chip is arranged on the insulating glue and is not overlapped with the second conductive blocks. The first conductivewires and the second conductive wires are electrically connected with the two second conductive blocks respectively and are electrically connected with the instantaneous voltage suppression chip.