Invention Grant
- Patent Title: Low-temperature bonding of refractory ceramic layers
- Patent Title (中): 耐火陶瓷层的低温连接
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Application No.: EP09169743.3Application Date: 2009-09-08
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Publication No.: EP2166601B1Publication Date: 2013-06-19
- Inventor: Jain, Kailash Chandra , Kerr, Rick Daniel , Gillispie, Bryan A. , Parsian, Mohammad , Keller, Joseph Michael , Thompson, David Allen
- Applicant: Delphi Technologies, Inc.
- Applicant Address: P.O.Box 5052 Troy MI 48007 US
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: P.O.Box 5052 Troy MI 48007 US
- Agency: Robert, Vincent
- Priority: US284499 20080923
- Main IPC: H01M4/86
- IPC: H01M4/86 ; H01M4/88 ; H01M4/90 ; H01M8/12
Public/Granted literature
- EP2166601A1 Low-temperature bonding of refractory ceramic layers Public/Granted day:2010-03-24
Information query
