Invention Grant
- Patent Title: Implant device for osseous integration
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Application No.: US14977234Application Date: 2015-12-21
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Publication No.: US10064737B2Publication Date: 2018-09-04
- Inventor: Jane S C Tsai , Hsin-Hsin Shen , Fang-Hei Tsau , Ji-Bin Horng , Pei-I Tsai , Chih-Chieh Huang , Yi-Hung Wen , Hong-Jen Lai , Sung-Ho Liu , Ching-Chih Lin , Meng-Huang Wu
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW104140981A 20151207
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61B17/86

Abstract:
An implant device for osseous integration includes a plurality of connection bars and at least one frame bar. These connection bars are connected with each other to form a three-dimensional (3D) grid structure. The frame bar is connected with at least two of the connection bars to define at least one edge of the 3D grid structure. Wherein, the frame bar has a diameter substantially greater than that of these connection bars.
Public/Granted literature
- US20170156878A1 IMPLANT DEVICE FOR OSSEOUS INTEGRATION Public/Granted day:2017-06-08
Information query
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