Invention Grant
- Patent Title: Flexible printed circuit board structure
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Application No.: US15438634Application Date: 2017-02-21
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Publication No.: US10104778B2Publication Date: 2018-10-16
- Inventor: Yi-Chun Liu , Pei-Hao Hung , Wen-Chien Hsu , Meng-Huan Chia , Min-Ming Tsai , Shan-Yi Tseng , Yuan-Chih Lee
- Applicant: UNIFLEX Technology Inc.
- Applicant Address: TW Taichung
- Assignee: UNIFLEX Technology Inc.
- Current Assignee: UNIFLEX Technology Inc.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: TW105138031A 20161121
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02

Abstract:
A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.
Public/Granted literature
- US20180146552A1 FLEXIBLE PRINTED CIRCUIT BOARD STRUCTURE Public/Granted day:2018-05-24
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