Invention Grant
- Patent Title: Methods for processing a semiconductor workpiece
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Application No.: US15359620Application Date: 2016-11-23
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Publication No.: US10157765B2Publication Date: 2018-12-18
- Inventor: Gudrun Stranzl , Martin Zgaga , Rainer Leuschner , Bernhard Goller , Bernhard Boche , Manfred Engelhardt , Hermann Wendt , Bernd Noehammer , Karl Mayer , Michael Roesner , Monika Cornelia Voerckel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/683 ; H01L21/283 ; H01L21/78 ; H01L21/033 ; H01L21/285 ; H01L21/304 ; H01L21/3065 ; H01L21/308 ; H01L21/768
Abstract:
Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.
Public/Granted literature
- US20170076970A1 METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE Public/Granted day:2017-03-16
Information query
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