Invention Grant
- Patent Title: Housing for electroic device and method for making same
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Application No.: US15434064Application Date: 2017-02-16
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Publication No.: US10245882B2Publication Date: 2019-04-02
- Inventor: Yu-Tsai Wang , Ying-Bo Yang , Shui-Ying Chen , Bi-Ling Dong
- Applicant: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. , FIH (HONG KONG) LIMITED
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: SHENZHEN FUTAIHONG PRECISON INDUSTRY CO,FIH (HONG KONG) LIMITED
- Current Assignee: SHENZHEN FUTAIHONG PRECISON INDUSTRY CO,FIH (HONG KONG) LIMITED
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: ScienBiziP, P.C.
- Priority: CN201510199459 20150424
- Main IPC: G21H5/00
- IPC: G21H5/00 ; C08J7/18 ; B05D3/00 ; B44F1/08 ; B05D3/06 ; B05D3/02 ; H04M1/02 ; B05D1/02 ; B41M5/24 ; B41M5/28 ; B41M7/00 ; G01K11/12 ; H04B1/3888 ; B05D5/06
Abstract:
A method of making a housing comprises: providing a ceramic body; forming a pattern layer on a surface of the ceramic body to form an embedding member, wherein the pattern layer comprises at least one pattern, the pattern layer is made of thermo-sensitive ink material, and forming a base to integrated with the ceramic body formed with the least one pattern.
Public/Granted literature
- US20170157978A1 HOUSING FOR ELECTROIC DEVICE AND METHOD FOR MAKING SAME Public/Granted day:2017-06-08
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