Invention Grant
- Patent Title: Single-package phased array module with interleaved sub-arrays
-
Application No.: US15197531Application Date: 2016-06-29
-
Publication No.: US10263346B2Publication Date: 2019-04-16
- Inventor: Telesphor Kamgaing , Adel A. Elsherbini
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01Q21/29
- IPC: H01Q21/29 ; H01Q3/24 ; H01Q3/26 ; H01Q15/08 ; H01Q21/06 ; H01Q23/00 ; H01Q25/00 ; H01P11/00 ; H01Q1/50 ; H01Q1/36

Abstract:
Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.
Public/Granted literature
- US20160308287A1 SINGLE-PACKAGE PHASED ARRAY MODULE WITH INTERLEAVED SUB-ARRAYS Public/Granted day:2016-10-20
Information query