Invention Grant
- Patent Title: Systems and methods for preparing bone voids to receive a prosthesis
-
Application No.: US15597851Application Date: 2017-05-17
-
Publication No.: US10265083B2Publication Date: 2019-04-23
- Inventor: Damon J. Servidio , Carlos E. Collazo , Sujit Sivadas
- Applicant: Howmedica Osteonics Corp.
- Applicant Address: US NJ Mahwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Mahwah
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: A61B17/16
- IPC: A61B17/16 ; A61F2/38 ; A61B17/17 ; A61F2/30
Abstract:
A method of implant a knee prosthesis includes forming a bone void at an end of a bone, implanting a void filler in the bone void, and implanting a knee prosthesis onto the end of the bone so that a stem of the knee prosthesis is received by the void filler.
Public/Granted literature
- US20170246012A1 SYSTEMS AND METHODS FOR PREPARING BONE VOIDS TO RECEIVE A PROSTHESIS Public/Granted day:2017-08-31
Information query
