Invention Grant
- Patent Title: Ion implantation method and ion implantation apparatus
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Application No.: US15816838Application Date: 2017-11-17
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Publication No.: US10283422B2Publication Date: 2019-05-07
- Inventor: Hiroyuki Kariya , Hideki Morikawa , Masaki Ishikawa
- Applicant: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2016-225935 20161121
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01J37/08 ; H01J37/147 ; H01J37/244 ; H01J37/317 ; H01L21/265

Abstract:
An ion implantation method includes measuring a beam energy of an ion beam that is generated by a high-energy multistage linear acceleration unit operating in accordance with a tentative high-frequency parameter, adjusting a value of the high-frequency parameter based on the measured beam energy, and performing ion implantation by using the ion beam generated by the high-energy multistage linear acceleration unit operating in accordance with the adjusted high-frequency parameter. The tentative high-frequency parameter provides a value different from a value of the high-frequency parameter for achieving a maximum acceleration in design to a high-frequency resonator in a part of stages including at least a most downstream stage. The adjusting includes changing at least one of a voltage amplitude and a phase set for the high-frequency resonator in the part including the at least most downstream stage.
Public/Granted literature
- US20180145000A1 ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS Public/Granted day:2018-05-24
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