Invention Grant
- Patent Title: Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance
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Application No.: US15590520Application Date: 2017-05-09
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Publication No.: US10366924B2Publication Date: 2019-07-30
- Inventor: Thorsten Scharf , Steffen Jordan
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102016109853 20160530
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L23/00 ; H01L23/373 ; H01L23/492 ; H01L23/498 ; H01L23/538 ; H01L25/065 ; H01L23/34
Abstract:
A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.
Public/Granted literature
Information query
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