公开(公告)号：US20220108974A1

公开(公告)日：2022-04-07

申请号：US17491647

申请日：2021-10-01

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Alexander Heinrich ,  Steffen Jordan

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/498

Abstract: A method of forming a chip package is provided. The method includes providing a malleable carrier with a layer of an electrically conductive material formed thereon, and positive fitting the malleable carrier to a chip to at least partially enclose the chip with the malleable carrier. The layer at least partially physically contacts the chip, such that the layer electrically contacts a chip contact of the chip. The layer forms a redistribution layer.

公开(公告)号：US20170250152A1

公开(公告)日：2017-08-31

申请号：US15436778

申请日：2017-02-18

Applicant: Infineon Technologies AG

Inventor： Thorsten SCHARF ,  Steffen Jordan ,  Wolfgang Schober ,  Thomas Ziegler

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/065 ,  H01L25/00 ,  H01L21/78 ,  H01L23/31

CPC classification number: H01L24/08 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/03 ,  H01L24/06 ,  H01L24/17 ,  H01L24/43 ,  H01L24/45 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/18 ,  H01L2924/01015

Abstract: A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.

公开(公告)号：US20170229399A1

公开(公告)日：2017-08-10

申请号：US15426158

申请日：2017-02-07

Applicant: Infineon Technologies AG

Inventor： Martin Gruber ,  Steffen Jordan

IPC: H01L23/538 ,  H01L23/31 ,  H01L21/683 ,  H01L21/288 ,  H01L23/58 ,  H01L25/065 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L23/5389 ,  C23C18/1653 ,  C25D7/00 ,  H01L21/2885 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76873 ,  H01L21/76877 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/585 ,  H01L24/00 ,  H01L25/0655 ,  H01L2221/68359

Abstract: The method comprises providing a plurality of electronic devices, embedding the electronic devices in an encapsulation layer, forming vias into the encapsulation layer, the vias extending from a main face of the encapsulation layer to the electronic devices, and depositing a metallic layer onto the encapsulation layer including the vias by galvanic plating, the method further comprising providing a current distribution layer for effecting a distributed growth of the metallic material during the galvanic plating.

公开(公告)号：US10366924B2

公开(公告)日：2019-07-30

申请号：US15590520

申请日：2017-05-09

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Steffen Jordan

IPC: H01L21/78 ,  H01L23/00 ,  H01L23/373 ,  H01L23/492 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/34

Abstract: A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

公开(公告)号：US20170345714A1

公开(公告)日：2017-11-30

申请号：US15590520

申请日：2017-05-09

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Steffen Jordan

IPC: H01L21/78 ,  H01L23/492 ,  H01L23/373 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L21/78 ,  H01L23/34 ,  H01L23/373 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49844 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/06 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/36 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13101 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24246 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

公开(公告)号：US12288727B2

公开(公告)日：2025-04-29

申请号：US18130662

申请日：2023-04-04

Applicant: Infineon Technologies AG

Inventor： Edmund Riedl ,  Steffen Jordan ,  Stefan Miethaner ,  Stefan Schwab

IPC: H01L23/29 ,  H01L21/56

Abstract: A method of manufacturing a package includes forming an adhesion promoter on at least part of an electronic component. The adhesion promoter is a morphological adhesion promoter including a morphological structure having a plurality of openings. The method further includes at least partially encapsulating the electronic component with an inorganic encapsulant with the adhesion promoter in between. The adhesion promoter enhances adhesion between at least part of the electronic component and the encapsulant.

公开(公告)号：US11862600B2

公开(公告)日：2024-01-02

申请号：US17491647

申请日：2021-10-01

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Alexander Heinrich ,  Steffen Jordan

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L24/80 ,  H01L21/565 ,  H01L23/4985 ,  H01L2224/80357 ,  H01L2224/83385 ,  H01L2924/1511 ,  H01L2924/15724 ,  H01L2924/15738

Abstract: A method of forming a chip package is provided. The method includes providing a malleable carrier with a layer of an electrically conductive material formed thereon, and positive fitting the malleable carrier to a chip to at least partially enclose the chip with the malleable carrier. The layer at least partially physically contacts the chip, such that the layer electrically contacts a chip contact of the chip. The layer forms a redistribution layer.

公开(公告)号：US20230260860A1

公开(公告)日：2023-08-17

申请号：US18130662

申请日：2023-04-04

Applicant: Infineon Technologies AG

Inventor： Edmund Riedl ,  Steffen Jordan ,  Stefan Miethaner ,  Stefan Schwab

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/29 ,  H01L21/56

Abstract: A method of manufacturing a package includes forming an adhesion promoter on at least part of an electronic component. The adhesion promoter is a morphological adhesion promoter including a morphological structure having a plurality of openings. The method further includes at least partially encapsulating the electronic component with an inorganic encapsulant with the adhesion promoter in between. The adhesion promoter enhances adhesion between at least part of the electronic component and the encapsulant.

公开(公告)号：US11652012B2

公开(公告)日：2023-05-16

申请号：US16913188

申请日：2020-06-26

Applicant: Infineon Technologies AG

Inventor： Edmund Riedl ,  Steffen Jordan ,  Stefan Miethaner ,  Stefan Schwab

IPC: H01L23/29 ,  H01L21/56

CPC classification number: H01L23/29 ,  H01L21/56

Abstract: A package includes an electronic component, an inorganic encapsulant encapsulating at least part of the electronic component, and an adhesion promoter between at least part of the electronic component and the encapsulant.

公开(公告)号：US12230547B2

公开(公告)日：2025-02-18

申请号：US18130662

申请日：2023-04-04

Applicant: Infineon Technologies AG

Inventor： Edmund Riedl ,  Steffen Jordan ,  Stefan Miethaner ,  Stefan Schwab

IPC: H01L23/29 ,  H01L21/56

Abstract: A method of manufacturing a package includes forming an adhesion promoter on at least part of an electronic component. The adhesion promoter is a morphological adhesion promoter including a morphological structure having a plurality of openings. The method further includes at least partially encapsulating the electronic component with an inorganic encapsulant with the adhesion promoter in between. The adhesion promoter enhances adhesion between at least part of the electronic component and the encapsulant.