Invention Grant
- Patent Title: Semiconductor structure and manufacturing method thereof
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Application No.: US15979476Application Date: 2018-05-15
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Publication No.: US10366995B2Publication Date: 2019-07-30
- Inventor: Wei-Che Chang , Yoshinori Tanaka
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: CN201710532559 20170703
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/762 ; H01L29/06

Abstract:
A semiconductor structure includes a substrate, and first isolation structures, at least one buried word line and at least one second isolation structure which are disposed in the substrate. The buried word line intersects the first isolation structures. The second isolation structure intersects the first isolation structures. A material of at least a portion of the second isolation structure is different from a material of the first isolation structures.
Public/Granted literature
- US20190006369A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-01-03
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