An electronic component may include e.g. a solid-state light radiation source, preferably a LED light radiation source, is provided with electrical contact pads for soldering onto a mounting board. The electrical contact pads are arranged over a soldering area having a central portion and a peripheral portion surrounding said central portion.The electrical contact pads include at least one first electrical contact pad arranged at central portion of the soldering area, and at least one second electrical contact pad arranged at peripheral portion of the soldering area.